CELCON® M90™ | POM | Unfilled
Description结肠炎吃什么
Celcon acetal copolymer grade M90™ is a medium viscosity polymer providing optimum performance in general purpo injection molding and extrusion of thin walled tubing and thin gauge film. This grade provides overall excellent performance in many applications.
Chemical abbreviation according to ISO 1043-1: POM
Plea also e Hostaform® C 9021.
Physical properties Value Unit Test Standard Density1410kg/m³ISO 1183
Melt volume rate (MVR)8cm³/10min ISO 1133 MVR test temperature190°C ISO 1133
MVR test load 2.16kg ISO 1133
Mold shrinkage - parallel2%ISO 294-4abcd的词语
Mold shrinkage - normal 1.9%ISO 294-4
Water absorption (23°C-sat)0.75%ISO 62
Humidity absorption (23°C/50%RH)0.2%ISO 62 Mechanical properties Value Unit Test Standard
Tensile modulus (1mm/min)2760MPa ISO 527-2/1A Tensile stress at yield (50mm/min)66MPa ISO 527-2/1A Tensile strain at yield (50mm/min)10%ISO 527-2/1A Tensile creep modulus (1h)2450MPa ISO 899-1
Tensile creep modulus (1000h)1350MPa ISO 899-1
Flexural modulus (23°C)2550MPa ISO 178
Charpy impact strength @ 23°C188.0kJ/m²ISO 179/1eU Charpy impact strength @ -30°C181.0kJ/m²ISO 179/1eU Charpy notched impact strength @ 23°C 6.0kJ/m²ISO 179/1eA Char
py notched impact strength @ -30°C 6.0kJ/m²ISO 179/1eA Notched impact strength (Izod) @ 23°C 5.7kJ/m²ISO 180/1A
Thermal properties Value Unit Test Standard Melting temperature (10°C/min)165°C ISO 11357-1,-2,-3 DTUL @ 1.8 MPa101°C ISO 75-1/-2
DTUL @ 0.45 MPa158°C ISO 75-1/-2
Coeff.of linear therm. expansion (parallel) 1.2E-4/°C ISO 11359-2 Coeff.of linear therm. expansion (normal) 1.2E-4/°C ISO 11359-2
Electrical properties Value Unit Test Standard Volume resistivity8E12Ohm*m IEC 60093
Surface resistivity3E16Ohm IEC 60093
Test specimen production Value Unit Test Standard Processing conditions acc. ISO9988-2-Internal
CELCON® M90™ | POM | Unfilled
Rheological Calculation properties Value Unit Test Standard Density of melt1200kg/m³Internal Thermal conductivity of melt0.155W/(m K)Internal Specific heat capacity of melt2210J/(kg K)Internal
Eff. thermal diffusivity 4.85E-8m²/s Internal Ejection temperature140°C Internal
Stress-strain Secant modulus-strain
CELCON® M90™ | POM | Unfilled
Stress-strain (isochronous)Creep modulus-time
Stress-strain (isochronous)Creep modulus-time
CELCON® M90™ | POM | Unfilled
秦始皇的孩子
Typical injection moulding processing conditions
Pre Drying:
Drying is not normally required. If material has come in contact with moisture through improper storage or handling or through regrind u, drying may be necessary to prevent splay and odor problems.
Drying time: 3 h
Drying temperature: 80 - 100 °C
Temperature:
Manifold Mold Melt Nozzle Zone4Zone3Zone2Zone1
各种脸型min (°C)18080180190190180180170
max (°C)200120200200200190190180
涉足的意思
Pressure:
Inj press Hold press Back pressure
min (bar)6006000
max (bar)1200120040
Above pressures, including back pressure, are given as specific or plastic pressures. The back pressure on Hostaform® and Celcon® POM materials should be as low as possible, just enough to remove air from the pellets during feeding.
Speed:
Injection speed: slow-medium
Injection Molding
Standard reciprocating screw injection molding machines with a high compression screw (minimum 3:1 and preferably 4:1) and low back pressure (0.35 Mpa/50 PSI) are favored. Using a low compression screw (I.E. general purpo 2:1 compression ratio) can result in unmelted particles and poor melt homogeneity. Using a high back pressure to make up for a low compression ratio may lead to excessive shear heating and deterioration of the material.
Melt Temperature: Preferred range 182-199 C (360-390 F). Melt temperature should never exceed 230 C (450 F).
Mold Surface Temperature: Preferred range 82-93 C (180-200 F) especially with wall thickness less than 1.5 mm (0.060 in.). May require mold temperature as high as 120 C (250 F) to reproduce mold surface or to assure minimal molded in stress. Wall thickness greater than 3mm (1/8 in.) may u a cooler (65 C/150 F) mold surface temperature and wall thickness over
6mm (1/4 in.) may u a cold mold surface down to 25 C (80 F). In general, mold surface temperatures lower than 82 C (180 F) may hinder weld line formation and produce a hazy surface or a surface with flow lines, pits and other included defects that can hinder part performance.
CELCON® M90™ | POM | Unfilled
Film Extrusion
婚礼策划方案流程
牟取Standard extruders with a length to diameter ratio of at least 20:1 are recommended. The screw should be a high compression ratio of at least 3:1 and preferably 4:1 to assure good melting and melt homogeneity. The design should be approximately 35% each for feed and metering ctions with the remaining 30% as the transition zone.
Melt temperature: 160-220 C (320-430 F)
Other Extrusion
Standard extruders with a length to diameter ratio of at least 20:1 are recommended. The screw should be a high compression ratio of at least 3:1 and preferably 4:1 to assure good melting and uniform melt homogeneity. The design should be approximately 35% each for the feed and metering ctions with the remaining 30% as transition zone.
Melt temperature 180-220 C (355-430F)
Profile Extrusion
Standard extruders with a length to diameter ratio of at least 20:1 are recommended. The screw should be a high compression ratio of at least 3:1 and preferably 4:1 to assure good melting and mel
t homogeneity. The design should be approximately 35% each for feed and metering ctions with the remaining 30% as the transition zone.
Melt temperature: 180-220 C (360-430 F).
Sheet Extrusion
Standard extruders with a length to diameter ratio of at least 20:1 are recommended. The screw should be a high compression ratio (at least 3:1 and preferably 4:1) to assure good melting and uniform melt homogeneity. The screw design should be approximately 35% each for the feed and metering ctions with the remaining 30% as the transition zone.
Melt temperature 180-190 C (355-375 F).
Blow Molding
Consult product information rvices.
Calandering
Consult product information rvices.
Compression Molding
Consult product information rvices.
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