专利名称：WAFER TABLE, SURFACE PROTECTIVE FILM虚拟键
PEELING APPARATUS AND SURFACE
PROTECTIVE FILM PEELING METHOD
发明人：Hideo Kino,Minoru Amatani
申请号：US12664870
申请日：20080617
爱国名诗
公开号：US20100181019A1
键盘排序公开日：
献血的条件
20100722
专利内容由知识产权出版社提供
专利附图：
元宵节古诗
摘要：The wafer table () for holding a wafer () having the back surface thereof
supported by a mount frame () via a dicing film () and the front surface thereof with a
司马相如卓文君surface protective film () attached thereon is described. A groove () is formed in the area of the table corresponding to at least a part of the outer periphery of the wafer. Further, the table includes a holding means () for holding the wafer to the front surface of the table and a suction means for suction of the air in the groove. Thus, the dicing film can be positively collapd in the groove while at the same time being restored to the original position.冰棍怎么做
打女孩屁股申请人：Hideo Kino,Minoru Amatani
地址：Tokyo JP,Tokyo JP
国籍：JP,JP
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