Catching the Mobile Wave: Packaging is Going 3D
2008 Burn-in and Test Socket Workshop
March 9 -12, 2008
Belgacem Haba, Ph.D.
违背道德的三明治
Tesra
Outline
•Introduction
牛蛙吃什么
•Driving forces and limitations
•3-D package stacking
•3-D wafer-level stacking
•3-D by embedding technologies
•3-D in optics
•Conclusion
第一次去男朋友家03/09/2008Catching the Mobile Wave: Packaging is Going 3D 2
03/09/2008Catching the Mobile Wave: Packaging is Going 3D 3
Packaging is the key
•About 1cm cube of silicon
•The rest is Packaging
山东大学青春山大03/09/2008Catching the Mobile Wave: Packaging is Going 3D 4
Mobile Phone Evolution
1970s ~$5000Voice 1980s ~$4000Voice 1990s ~$300Voice Today Free Voice, Data
03/09/2008Catching the Mobile Wave: Packaging is Going 3D 5
Evolution of Memory
谢谢你我爱你•5MB IBM hard drive, 1956Jan 7th PR: SanDisk Announces the 12-
Gigabyte microSDHC Card –
the World's Largest Capacity Card for
Mobile Phones
03/09/2008Catching the Mobile Wave: Packaging is Going 3D 6我的理想是当一名老师
Outline
•Introduction
•Driving forces and limitations •3-D package stacking
•3-D wafer-level stacking
•3-D by embedding technologies •3-D in optics
•Conclusion
03/09/2008Catching the Mobile Wave: Packaging is Going 3D 7The Inside of Mobile Phones Display
Camera Module LEDs Substrate
Discretes Subsystem Connector
Mobile Phone Distribution of BOM
Mobile Phone Components IC Packaging
6%
ICs
35%
Other 22%
Displays
17%
Discretes
& LEDs
4%
Connectors 3%
Substrates 5%Cameras 8%
“Off-Chip
Electronics”
六年级上册简便计算Source: Portelligent, Tesra 03/09/2008Catching the Mobile Wave: Packaging is Going 3D 8
Source: ITRS & iNEMI 2007 updates
Macro Trends in Packaging 2007 ITRS & iNEMI Updates邮件服务
Which way to go?
Source: ITRS Asmbly & Packaging WG, April ‘07
03/09/2008Catching the Mobile Wave: Packaging is Going 3D 9
Mobile Phone
Source: Portelligent 03/09/2008Catching the Mobile Wave: Packaging is Going 3D 10
