Thermo-Mechanical Challenges in Stacked
Packaging家委会自我介绍简短
期刊名称： Heat Transfer Engineering
选题意义怎么写作者： DEREJE AGONAFER,ABHIJIT KAISARE,MOHAMMAD M. HOSSAIN,YONGJE LEE,BHAVANI P. DEWAN-SANDUR,TERRY DISHONGH,SENOL PEKIN
作者机构： Electronics,
年份： 2008年史记多少篇
有趣的课堂作文>秋天水果
期号： 第2期
女士西装关键词： pha-nsitive acoustic microscopy;mechanical properties;microscopic NDC;microscopic NDE;vector contrast ultrasound imaging
警校实习报告摘要：The convergence of computing and communications dictates building up rather than out. As con
sumers demand more functionality in their hand-held devices, the need for more memory in a limited space is increasing, and integrating various functions into the same package is becoming more crucial. Over the past few years, die stacking has emerged as a powerful tool for satisfying the challenging integrated circuit (IC) packaging requirements. In this paper, a review of thermo-mechanical challenges for stacked die packaging is discusd.
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