专利名称：STACKED MODULE PACKAGE
INTERCONNECT STRUCTURE WITH FLEX
CABLE
发明人：Aniket PATIL,Hong Bok WE,Brigham NAVAJA
袁祥
申请号：US16824811
申请日：20200320
公开号：US20210296280A1
形容雨大的句子公开日：
20210923
专利内容由知识产权出版社提供
专利附图：
摘要：Certain aspects of the prent disclosure provide apparatus and techniques for connecting pa电子蚊香
浑浑噩噩的意思
ckages for integrated circuits or packaged asmblies with other packages什么是记叙文
汉语补语or modules using flex cables. An example packaged asmbly for integrated circuits includes: a first integrated circuit (IC) package, a cond IC package dispod above the first IC package, and a flex cable, wherein an end of the flex cable is connected to at least one of the first IC package or the cond IC package.
申请人：QUALCOMM Incorporated
生产计划表模板地址：San Diego CA US
国籍：US
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