专利名称:Stacked chip connection using stand off
stitch bonding
发明人:Neal M. Bowen
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申请号:US10002175
大脸发型设计图片申请日:20011205
公开号:US07021520B2
公开日:
20060404
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专利内容由知识产权出版社提供
专利附图:
摘要:The prent invention provides a structure, apparatus, and method for wire bonding in which a first wire bond is formed between first and cond components, a
cond wire bond is formed between the cond component and a third component such
that the cond wire bond is in electrical communication with the first wire bond, wherein the first and cond wire bonds are connected to said first and cond components, respectively, using ball bonding.
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吉他要学多久申请人:Neal M. Bowen
白羊女天蝎男地址:Kuna ID US
国籍:US
代理机构:Dickstein Shapiro Morin & Oshinsky LLP吴心怡
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