如火如茶专利名称：WAFER STACKED PACKAGE WAVING
BERTICAL HEAT EMISSION PATH AND
METHOD OF FABRICATING THE SAME
发明人：Joong-Hyun BAEK,Hee-Jin LEE
申请号：US12581920
申请日：20091020
公开号：US20100038769A1
公开日：
教师学习
崛起1858
20100218
虫儿飞歌
专利内容由知识产权出版社提供
专利附图：
摘要：A wafer stacked miconductor package (WSP) having a vertical heat emission path and a method of fabricating the same are provided. The WSP compris a substrate
on which miconductor chips are mounted; a plurality of miconductor chips stacked vertically on the substrate; a cooling through-hole formed vertically in the plurality of miconductor chips, and aled; micro holes formed on the circumference of the cooling through-hole; and coolant filling the inside of the cooling through-hole. Accordingly, the WSP reduces a temperature difference between the miconductor chips and quickly dissipates the heat generated by the stacked miconductor chips.
孕酮是什么申请人：Joong-Hyun BAEK,Hee-Jin LEE
赵之谦篆书>盲孩子和他的影子地址：Suwon-si KR,Seongnam-si KR
国籍：KR,KR
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