专利名称：Adhesive composition and process for curing the same
发明人：Shigeki Matsushita,Fumihiko Kobayashi
申请号：US08/676300
申请日：19960717激情八月天
银河帝国基地
点餐英语公开号：US05717009A
公开日：
19980210
公务员条件专利内容由知识产权出版社提供
摘要：An adhesive composition which compris:睡前故事童话
(A) 100 parts by weight of a polyorganosiloxane reprented by the formula (I) :
##STR1## (wherein R.sup.1 s may be the same or different from each other and each reprent a monovalent hydrocarbon group or a halogen- substituted hydrocarbon group; and n is a positive integer);
< P>(B) 0.5 to 10 parts by weight of a tetraalkoxysilane reprented by the following formula:
R.sup.2.sub.a Si(OR.sup.3).sub.4- a (II)
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(wherein R.sup.2 reprents an alkyl group having 1 to 3 carbon atoms, a phenyl group or a vinyl group; R.sup.3 reprents an alkyl group having 1 to 4 carbon atoms or an alkoxy-substituted alkyl group having 3 to 6 carbon atoms; and a is 0 or 1), or a partially hydrolyzed condensate thereof; and肿节风分散片
(C) 0.1 to 15 parts by weight of a trialkoxysilane reprented by the formula (III) :
R.sup.4 (R.sup.5).sub.b Si(OR.sup.6).sub.3-b (III)< P>
(wherein R.sup.4 reprents a substituted or unsubstituted aminoalkyl group; R.sup.5 reprents an alkyl group having 1 to 3 carbon atoms, a phenyl group or a vinyl group; R.sup.6 reprents an alkyl group having 1 to 3 carbon atoms; and b is 0 or 1), wherein the molar ratio of total alkoxy groups in Components (B) and (C) to hydroxyl groups in Component (A) is (--OR.sup.2 +--OR.sup.6)/--OH > 8, and a process for curing the same.
毛笔字帖楷书入门临摹字帖申请人：TOSHIBA SILICONE CO., LTD.
代理机构：Jordan and Hamburg
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