PCB Heatsink

更新时间:2023-06-12 19:26:02 阅读: 评论:0

腾讯客服电话专利名称:PCB Heatsink
发明人:Murphy, Patrick K.
申请号:EP03405610.1
艾黎>秦统一六国时间
申请日:20030821
公开号:EP1395103A2
公开日:蕃茄牛腩
20040303
专利内容由知识产权出版社提供
专利附图:
摘要:A heatsink for a printed circuit board (PCB) overlies most or all of the board. It is clamped tightly to the board with its board-facing surface in clo proximity to the
heat-generating components on the board. A pliant, thermally-conductive dielectric layer is sandwiched between the PCB and the facing surface of the heatsink. Lands at various
heights are formed on the heatsink surface facing the PCB to be in good heat-conducting proximity to the surfaces of heat-generating circuit components of various heights on the PCB.
囊成语申请人:Delta Energy Systems AG
地址:Belpstras 37 3000 Bern 14 CH
国籍:CH埋藏的意思
蓝色的玫瑰代理机构:Roshardt, Werner Alfred, Dipl.-Phys.王尧臣
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