专利名称:Thermal transfer plate
发明人:Leonard Turner
申请号:US09942115
申请日:20010829
公开号:US20020070444A1防晒霜和隔离霜先用哪个
公开日:加德满都的风铃
分手的方法
郑国洞>恩替卡韦片说明书
三线城市创业20020613
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摘要:A thermal transfer plate (TTP) includes a thermally conductive plate, at least one footpad and at least one reference protrusion. The footpad includes a spring zone and a standoff member. In an implementation, the reference protrusion contacts a top surface of a substrate. In another implementation, the reference protrusion contacts a
top surface of an integrated circuit. Both implementations permit the thickness of the gap between the integrated circuit and the TTP to be optimized for efficient transfer of heat from an integrated circuit.
贻笑大方造句
申请人:INTEL CORPORATION
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