专利名称：Thermally enhanced component substrate:
thermal bar天鹅洞
写一副春联发明人：Janne T Nurminen
申请号：US10646410摩托车壁纸
有暴力倾向怎么办
申请日：20030822
公开号：US06954360B2
公开日：
20051011
专利内容由知识产权出版社提供
事迹
专利附图：
摘要：An IC package dissipates thermal energy using thermal bars. The IC package includes a substrate material with a die pad area, which is suitable to support an integrated circuit. A plurality of solder ball pads is dispod on a first surface of the
substrate material and a plurality of conductive thermal bars radiate outwardly from the die pad area and extend to the edge of the substrate component to facilitate the dismination of thermal energy from the die pad area to the substrate and/or printed wiring board.
申请人：Janne T Nurminen
地址：Oulunsalo FI
生肖岁数国籍：FI
代理机构：Harrington & Smith LLP
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