Automotive Electronics Council
Page 1 of
3
Appendix 2: Q100 Certification of Design, Construction and Qualification
Supplier Name:
Date:
The following information is required to identify a device that has met the requirements of AEC-Q100. Submission of the
required data in the format shown below is optional.
All
entries
must 吧造句
be
completed;
if
a
particular
item
does
not
apply, enter "Not Applicable".
This template can be downloaded from the AEC website at
This template is available as a stand-alone document.
Item Name
Supplier Respon
1.
Ur’s Part Number:
2.
Supplier’s Part Number/Data Sheet:
3.
Device Description:
4.
Wafer/Die Fab Location & Process ID:
a.
Facility name/plant #:
b.
Street address:
c.
Country:
5.
Wafer Probe Location:
a.
Facility name/plant #:
b.
Street address:
c.
Country:
6.
Asmbly Location & Process ID:
a.
Facility name/plant #:
b.
Street address:
c.
Country:
7.
Final Quality Control A (Test) Location:
a.
Facility name/plant #:
b.
Street address:
c.
Country:
属鼠和属猴8.
Wafer/Die:
a.
Wafer size:
b.
Die family:
c.
Die mask t revision & name:
d.
Die photo:
See attached
Not available
9.
Wafer/Die Technology Description:
a.
日本沼虾
Wafer/Die process technology:
b.
色彩搭配网站
Die channel length:
c.
Die gate length:
d.
Die supplier process ID (Mask #):
e.
Number of transistors or gates:
f.
Number of mask steps:
10.
Die Dimensions: 跳绳方法
a.
Die width:
店面转租b.
Die length:
c.
Die thickness (finished):
11.
Die Metallization:
a.
Die metallization material(s):
b.
Number of layers:
c.
Thickness (per layer):
d.
% of alloys (if prent):
12.
Die Passivation:
a.
Number of passivation layers:
b.
Die passivation material(s):
c.
Thickness(es) & tolerances:
13.
Die Overcoat Material (e.g., Polyimide):
AEC - Q100 - Rev G
May 14, 2007
Component Technical Committee
Automotive Electronics Council
Page 2 of
3
大气监测
14.
Die Cross-Section Photo/Drawing:
See attached
Not available
15.
Die Prep Backside:
a.
Die prep method:
b.
Die metallization:
c.
Thickness(es) & tolerances:
16.
Die Separation Method:
a.
Kerf width (
μ
m):
b.
Kerf depth (if not 100% saw):
c.
Saw method:
Single
Dual
17.
Die Attach:
a.
Die attach material ID:
b.
Die attach method:
c.
Die placement diagram:
See attached
Not available
18.
Package:
a.
Type of package (e.g., plastic, ceramic,
unpackaged):
b.
Ball/lead count:
c.
JEDEC designation (e.g., MS029,
MS034, etc.):
d.
Lead (Pb) free (< 0.1% homogenous
material):
e.
紫菜蛋汤的做法Package outline drawing:
