专利名称：Wafer shipping box and wafer
transportation method
发明人：Tim Hsiao,Jason Horng
首尾相应申请号：US10950852
申请日：20040927
公开号：US20060065571A1
公开日：
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20060330终止劳动合同通知书
专利内容由知识产权出版社提供
专利附图：选择恐惧症>解除劳动合同通知
考试反思摘要：A wafer shipping box for carrying a number of wafers is provided. The wafer shipping box includes a main body, a cover and a aling element. The cover can join up with the main body to al off wafers inside the wafer shipping box. A vent hole is t up
on either the body or the cover. The aling element is ud to al or open the vent hole. Through the aling element, the vent hole can be aled so that micro-particles and corrosive gas are prevented from contaminating the wafers and the interior of the wafer box during shipment.
申请人：Tim Hsiao,Jason Horng
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地址：Jhongli City TW,Hsinchu TW
国籍：TW,TW
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