Failure Analysis (FA) Introduction (Failure Analysis Concept)
To identify the failure mechanism of failed product.FA Concept:
年会诗朗诵
Not only to confirm the failure, but trace the root caus .FA Attitude:
1) Why/What/Who/When/How it failed.2) What should we do now.3) How do we improve better.
FA Value:
1) Identification of material-related defects.
2) Solving manufacturing problems.
炒鱿鱼须的家常做法
3) Solving rvice-related problem.
4) Providing corrective or prevention measures.
5) Providing manufacturers’insurance or legal defen/claim cas 6) To improve product design, production yield and reliability
-Failure mode
-Failure mechanism
-Root cau
•Current Status (Failure rate)•Failure Mode (EFA)
•Failure Mechanism (Possible)•Failure Analysis Technology (Tools)•FA Procedure (Flowchart)•Result Consistence (Date Speak)•Time Pressure (Resource Limit)
十加十
-Large Elastic
Deformation
-Yield
奋斗爱
-Buckling
-Brittle Fracture
姜子牙-Ductile Fracture
-Interfacial
De-adhesion
-Electromagnetic
Interference
Damage张骞出使西域的意义
-Electrical
Overstress
-Gate Oxide
Breakdown
Discharge
-Second
Breakdown
-Ionic
Contamination
-Single Event
Upt
-Soft Error
巨人脚步游戏规则-Fatigue Crack
Initiation
-Fatigue Crack
吸烟对人体的危害Propagation
-Creep
-
Wear
-Gate Oxide
Breakdown
Time Dependent
Dielectric
Breakdown
-Slow Trapping
-Surface charge
Spreading
-Hot electrons
-Hillock
Formation
-Contact Spiking
-Electromigration
-Diffusion
-Interdiffusion
-Corrosion
-Stress Corrosion
-Dendritic Growth
-Soft Error
-Excessive Leakage
Currents
-
Radiation Induced
Thermal Breakdown Thermo-
mechanical
Electrical Chemical
and Radiation
DC --Open/Short: Pin Continuity/ESD Test
--Leakage: Input Buffer High/Low Current Test --ICC: Standby/Dynamic/Refresh Current Test
AC --High/Low Voltage Applied
--Data High/Low (1/0) Applied
--Pattern (Scan/Checkerboard/March) Applied --Timing (Speed) Test
DC (Direct Current): Asmbly related EFA
AC (Alternative Current): Device related EFA
