CIRCUIT SUBSTRATE AND ELECTRONIC DEVICE

更新时间:2023-05-20 14:27:34 阅读: 评论:0

专利名称:CIRCUIT SUBSTRATE AND ELECTRONIC
DEVICE
发明人:Taiga Fukumori
申请号:US14838642
申请日:20150828
百合怎么做好吃公开号:US20160105955A1
小学入学
鸡肉汤公开日:
20160414
专利内容由知识产权出版社提供王者荣耀怎么打>英国香港
专利附图:
摘要:A circuit substrate includes: a plurality of signal wirings formed at different positions of the circuit substrate in a thickness direction and extending in parallel in the circuit substrate; and ground layers or power supply layers formed at both sides of the
nagitivecircuit substrate in the thickness direction by interposing the plurality of the signal wirings between the ground layers or between the power supply layers, wherein the plurality of signal wirings are electrically coupled with each other by a plurality of conductors formed at an interval narrower than an interval by which a resonance is caud.
申请人:FUJITSU LIMITED
朝鲜族图片地址:Kawasaki-shi JP
国籍:JP
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