专利名称：Glass core substrate for integrated circuit
海上小喔devices and methods of making the same
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日本美女写真集发明人：Qing Ma,Quan A. Tran,Robert L.
Sankman,Johanna M. Swan,Valluri R. Rao
申请号：US15172029
申请日：20160602
公开号：US09686861B2
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公开日：
20170620
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摘要：Disclod are embodiments of a glass core substrate for an integrated circuit (IC) device. The glass core substrate includes a glass core and build-up structures on
opposing sides of the glass core. Electrically conductive terminals may be formed on both sides of the glass core substrate. An IC die may be coupled with the terminals on one side of the substrate, whereas the terminals on the opposing side may be coupled with a next-level component, such as a circuit board. The glass core may compri a single piece of glass in which conductors have been formed, or the glass core may compri two or more glass ctions that have been joined together, each ction having conductors. The conductors extend through the glass core, and one or more of the conductors may be electrically coupled with the build-up structures dispod over the glass core. Other embodiments are described and claimed.
申请人：Intel Corporation
地址：Santa Clara CA US
新年祝福英语国籍：US
代理机构：Winkle, PLLC
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