专利名称：Pad alignment for AlCu pad for copper
process
发明人：Tsu Shih,Hung-Chang Hsieh,Chen-Cheng Kuo
电气自动化就业方向申请号：US09578409
休息休息申请日：20000526
胆囊炎能吃鸡蛋吗公开号：US06350680B1
公开日：
20020226
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摘要：A new method is provided for the alignment of the patterning of AlCu pads in an environment of copper interconnect line patterns. A layer of passivation material is deposited over a surface that contains alignment marks. The layer of passivation is
patterned creating in the surface of the layer of passivation the opening that is required for the AlCu pad in addition to openings for a new pattern of alignment marks. A layer of AlCu is sputter deposited over the surface of the layer of passivation thereby including the openings that have been created in the layer of passivation. This creates a new pattern of alignment marks in the surface of the deposited layer of AlCu whereby the new alignment marks align with the pattern of new alignment marks that has been etched in the layer of passivation. The new alignment marks are then ud to pattern the layer of AlCu for the creation of the AlCu pad.
申请人：TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
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代理人：George O. Saile,Stephen B. Ackerman
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