专利名称：PROCESS FOR IMPROVING PACKAGE
WARPAGE AND CONNECTION RELIABILITY
韩信
xiangcTHROUGH USE OF A BACKSIDE MOLD
班级风采CONFIGURATION (BSMC)
发明人：BCHIR, Omar, J.,SHAH, Milind, P.,MOVVA, Sashidhar
申请号：EP11725236.1
申请日：20110519
公开号：EP2572372B1
公开日：
手机充电口进水怎么办20200902央求近义词
圆周长的公式专利内容由知识产权出版社提供
水煮海鲜的做法摘要：A backside mold configuration (BSMC) process for manufacturing packaged integrated circuits includes applying a mold compound to a side of a packaging substrate opposite an attached die. The mold compound is deposited on a dielectric (such as photo resist). The mold compound and dielectric are patterned after coupling a die to the packaging substrate to expo a contact pad of the packaging substrate. After patterning the mold compound and dielectric, a packaging connection is coupled to contact pads through the mold compound and dielectric. The mold compound surrounding the packaging connection reduces warpage of the packaging substrate during processing. Additionally, patterning the dielectric after attaching the die improves reliability of the packaging connection.
古诗五年级
申请人：Qualcomm Incorporated
代理机构：Dunlop, Hugh Christopher
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