Semiconductor Manufacturing Technology
半导体制造技术
Instructor’s Manual
Michael Quirk
Julian Serda
Copyright Prentice Hall
Table of Contents
目录蚕豆的做法
Overview
I. Chapter
1. Semiconductor industry overview猜三个数字
2. Semiconductor materials
3. Device technologies—IC families
4. Silicon and wafer preparation
5. Chemicals in the industry
6. Contamination control
7. Process metrology
8. Process gas controls
9. IC fabrication overview
10. Oxidation
11. Deposition
12. Metallization
13. Photoresist
14. Exposure
15. Develop
16. Etch
17. Ion implant
18. Polish
19. Test
20. Asmbly and packaging
II. Answers to End-of-Chapter Review Questions
指日可下III. Test Bank (supplied on diskette)
IV. Chapter illustrations, tables, bulleted lists and major topics (supplied on CD-ROM)
Notes to Instructors:
1)The chapter overview provides a conci summary of the main topics in each chapter.
2)The correct answer for each test bank question is highlighted in bold. Test bank
questions are bad on the end-of-chapter questions. If a student studies the end-of-chapter questions (which are linked to the italicized words in each chapter), then they will be successful on the test bank questions.
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Chapter 1
Introduction to the Semiconductor Industry Die：管芯 defective：有缺陷的
Development of an Industry
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•The roots of the electronic industry are bad on the vacuum tube and early u of silicon for signal transmission prior to World War II. The first electronic computer, the ENIAC, was
developed at the University of Pennsylvania during World War II.
•William Shockley, John Bardeen and Walter Brattain invented the solid-state transistor at Bell Telephone Laboratories on December 16, 1947. The miconductor industry grew rapidly in the 1950s to commercialize the new transistor technology, with many early pioneers working in
Silicon Valley in Northern California.
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Circuit Integration
•The first integrated circuit, or IC, was independently co-invented by Jack Kilby at Texas Instruments and Robert Noyce at Fairchild Semiconductor in 1959. An IC integrates multiple electronic components on one substrate of silicon.
•Circuit integration eras are: small scale integration (SSI) with 2 - 50 components, medium scale integration (MSI) with 50 – 5k components, large scale integration (LSI) with 5k to 100k
components, very large scale integration (VLSI) with 100k to 1M components, and ultra large scale integration (ULSI) with > 1M components.
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IC Fabrication
•Chips (or die) are fabricated on a thin slice of silicon, known as a wafer (or substrate). Wafers are fabricated in a facility known as a wafer fab, or simply fab.
解释说明
•The five stages of IC fabrication are:番茄怎么种植
Wafer preparation: silicon is purified and prepared into wafers.
Wafer fabrication: microchips are fabricated in a wafer fab by either a merchant chip supplier, captive chip producer, fabless company or foundry.
Wafer test: Each individual die is probed and electrically tested to sort for good or bad chips.
Asmbly and packaging: Each individual die is asmbled into its electronic package.
Final test: Each packaged IC undergoes final electrical test.
•Key miconductor trends are:
Increa in chip performance through reduced critical dimensions (CD), more components per chip (Moore’s law, which predicts the doubling of components every 18-24 months) and
reduced power consumption.
Increa in chip reliability during usage.
Reduction in chip price, with an estimated price reduction of 100 million times for the 50 years prior to 1996.
The Electronic Era
•The 1950s saw the development of many different types of transistor technology, and lead to the development of the silicon age.
•The 1960s were an era of process development to begin the integration of ICs, with many new chip-manufacturing companies.
•The 1970s were the era of medium-scale integration and saw incread competition in the industry, the development of the microprocessor and the development of equipment technology. •The 1980s introduced automation into the wafer fab and improvements in manufacturing efficiency and product quality.
•The 1990s were the ULSI integration era with the volume production of a wide range of ICs with sub-micron geometries.
Career paths
•There are a wide range of career paths in miconductor manufacturing, including technician, engineer and management.
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幼儿园教学随笔Chapter 2 Characteristics of Semiconductor Materials
Atomic Structure
•The atomic model has three types of particles: neutral neutrons（不带电的中子）, positively charged protons（带正电的质子）in the nucleus and negatively charged electrons（带负电的核外电子） that orbit the nucleus. Outermost electrons are in the valence shell, and influence the chemical and physical properties of the atom. Ions form when an atom gains or los one or more electrons.
The Periodic Table
•The periodic table lists all known elements. The group number of the periodic table reprents the number of valence shell electrons of the element. We are primarily concerned with group numbers IA through VIIIA.
•Ionic bonds are formed when valence shell electrons are transferred from the atoms of one element to another. Unstable atoms (e.g., group VIIIA atoms becau they lack one electron) easily form ionic bonds.
•Covalent bonds have atoms of different elements that share valence shell electrons.
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