专利名称：Orientation Layer for Directed Self-
何天武Asmbly Patterning Process
公司承诺书
写芦荟的作文发明人：Tsung-Han Ko,Ching-Yu Chang,Kuan-Hsin Lo
申请号：US15875788
江苏状元申请日：20180119
公开号：US20180144928A1
公开日：
鞠躬精粹
20180524
专利内容由知识产权出版社提供
彭永春
专利附图：
摘要：Disclod is a method of forming a miconductor device using a lf-asmbly (DSA) patterning process. The method includes forming a patterned feature over a substrate; applying an orientation material that includes a first polymer and a cond
polymer over the substrate, wherein the first polymer has a first activation energy and the cond polymer has a cond activation energy; baking the substrate at first temperature thereby forming a first orientation layer that includes the first polymer; baking the substrate at cond temperature thereby forming a cond orientation layer that includes the cond polymer; and performing a directed lf-asmbly (DSA) process over the first and the cond orientation layers.已拼音
申请人：Taiwan Semiconductor Manufacturing Company, Ltd.
地址：Hsinchu TW
国籍：TW
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