Orientation Layer for Directed Self-Asmbly Patte

更新时间:2023-05-15 04:13:45 阅读: 评论:0

专利名称:Orientation Layer for Directed Self-
何天武Asmbly Patterning Process
公司承诺书
写芦荟的作文发明人:Tsung-Han Ko,Ching-Yu Chang,Kuan-Hsin Lo
申请号:US15875788
江苏状元申请日:20180119
公开号:US20180144928A1
公开日:
鞠躬精粹
20180524
专利内容由知识产权出版社提供
彭永春
专利附图:
摘要:Disclod is a method of forming a miconductor device using a lf-asmbly (DSA) patterning process. The method includes forming a patterned feature over a substrate; applying an orientation material that includes a first polymer and a cond
polymer over the substrate, wherein the first polymer has a first activation energy and the cond polymer has a cond activation energy; baking the substrate at first temperature thereby forming a first orientation layer that includes the first polymer; baking the substrate at cond temperature thereby forming a cond orientation layer that includes the cond polymer; and performing a directed lf-asmbly (DSA) process over the first and the cond orientation layers.已拼音
申请人:Taiwan Semiconductor Manufacturing Company, Ltd.
地址:Hsinchu TW
国籍:TW
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