Document Number: MPXV7002
Rev 0, 09/2005
Freescale Semiconductor Technical Data
© Freescale Semiconductor, Inc., 2005. All rights rerved.
Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated
The MPXV7002 ries piezoresistive transducers are state-of-the-art
monolithic silicon pressure nsors designed for a wide range of applications, but particularly tho employing a microcontroller or microprocessor with A/D inputs. This transducer combines advanced micromachining techniques, thin-film metallization, and bipolar processing to provide an accurate, high level analog output signal that is proportional to the applied pressure.Features • 2.5% Typical Error over +10°C to +60°C with Auto Zero
• 6.25% Maximum Error over +10°C to +60°C without Auto Zero
•Ideally Suited for Microprocessor or Microcontroller-Bad Systems •Thermoplastic (PPS) Surface Mount Package •Temperature Compensated over +10° to +60°C •Patented Silicon Shear Stress Strain Gauge
•Available in Differential and Gauge Configurations Typical Applications
•Hospital Beds •HVAC
•Respiratory Systems •
Process Control
ORDERING INFORMATION
Device Type
Options
Ca No.MPX Series Order No.Packing Options Device Marking SMALL OUTLINE PACKAGE (MPXV7002 SERIES)Ported Elements
Gauge, Axial Port, SMT 482A MPXV7002GC6U
Rails
MPXV 7002G
Gauge, Axial Port, SMT
482A MPXV 7002G C6T1Tape & Reel MPXV 7002G
Gauge, Side Port, SMT 1369MPXV 7002G P Trays MPXV 7002G Differential, Dual Port, SMT
1351MPXV 7002DP Trays MPXV 7002G Differential, Dual Port, SMT
1351
MPXV7002DPT1
土豆粉蒸肉Tape & Reel MPXV7002G MPXV7002 SERIES
INTEGRATED PRESSURE SENSOR -2 to 2 kPa (-0.3 to 0.3 psi)0.5 to 4.5 V OUTPUT SMALL OUTLINE PACKAGE
PIN NUMBERS
(1)
1.Pins 1, 5, 6, 7, and 8 are internal device connections. Do not connect to external circuitry or ground. Pin 1 is noted by the notch in the lead.
1N/C 5N/C 2V S 6N/C 3Gnd 7N/C 4
V out
8
N/C
Sensing Element
Thin Film Temperature Compensation
竹子的介绍and Gain Stage #1Gain Stage #2
and Ground Reference Shift Circuitry
V S
V out
GND
Pins 1 and 5 through 8 are NO CONNECTS for surface mount package
MPXV7002Sensors
Figure 1. Fully Integrated Pressure Sensor Schematic
Table 1. Maximum Ratings (1)
1.Exposure beyond the specified limits may cau permanent damage or degradation to the device.
Rating
Symbol Value Unit Maximum Pressure (P1 > P2)P max 8.0kPa Storage Temperature T stg –30 to +100°C Operating Temperature
复合文案T A
10 to +60
°C
Table 2. Operating Characteristics (V S = 5.0 Vdc, T A = 25°C unless otherwi noted. Decoupling circuit shown in Figure 3 required to meet specification.)
Characteristic
Symbol Min Typ Max Unit Pressure Range (1)1. 1.0 kPa (kiloPascal) equals 0.145 psi.
P OP –2.0— 2.0kPa Supply Voltage (2)2.Device is ratiometric within this specified excitation range.
V S 4.75 5.0 5.25Vdc Supply Current I o ——10mAdc Pressure Offt (3)(10 to 60°C)@ V S = 5.0 Volts 3.Offt (V off ) is defined as the output voltage at the minimum rated pressure.
V off 2.25 2.5 2.75Vdc Full Scale Output (4)(10 to 60°C)@ V S = 5.0 Volts 4.Full Scale Output (V FSO ) is defined as the output voltage at the maximum or full rated pressure.
V FSO 4.25 4.5 4.75Vdc Full Scale Span (5)(10 to 60°C)@ V S = 5.0 Volts 5.Full Scale Span (V FSS ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure.V FSS 3.5 4.0 4.5 V Vdc Accuracy (6)(10 to 60°C)
6.Accuracy (error budget) consists of the following:
•Linearity:Output deviation from a straight line relationship with pressure over the specified pressure range.
•Temperature Hysteresis:Output deviation at any temperature within the operating temperature range, after the temperature is cycled to
and from the minimum or maximum operating temperature points, with zero differential pressure applied.
盗墓的电影
•Pressure Hysteresis:Output deviation at any pressure within the specified range, when this pressure is cycled to and from the
minimum or maximum rated pressure, at 25°C.
•TcSpan:Output deviation over the temperature range of 10° to 60°C, relative to 25°C.•TcOfft:Output deviation with minimum rated pressure applied, over the temperature range of 10° to 60°C, relative to
25°C.
•Variation from Nominal:The variation from nominal values, for Offt or Full Scale Span, as a percent of V FSS , at 25°C.
——±2.5(7)7.Auto Zero at Factory Installation: Due to the nsitivity of the MPXV7002 Series, external mechanical stress and mounting position can affect the zero pressure output reading. Autozero is defined as storing the zero pressure output reading and subtracting this from the device'
s output during normal operations. Reference AN1636 for specific information. The specified accuracy assumes a maximum temperature change of ± 5°C between autozero and measurement.±6.25%V FSS Sensitivity V/P — 1.0—-V/kPa Respon Time (8)
8.Respon Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure.t R — 1.0—-ms Output Source Current at Full Scale Output I O+—0.1—-mAdc Warm-Up Time (9)
冷语9.Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized.
—
—
20
—-ms
MPXV7002
Sensors
ON-CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING
The performance over temperature is achieved by integrating the shear-stress strain gauge, temperature compensation, calibration and signal conditioning circuitry onto a single monolithic chip.鳕鱼块的做法
Figure 2 illustrates the Differential or Gauge configuration in the basic chip carrier (Ca 482). A gel die coat isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the nsor diaphragm.
The MPXV7002 ries pressure nsor operating
characteristics, and internal reliability and qualification tests are bad on u of dry air as the pressure media. Media, other than dry air, may have adver effects on nsor
performance and long-term reliability. Contact the factory for information regarding media compatibility in your application.Figure 3 shows the recommended decoupling circuit for interfacing the integrated nsor to the A/D input of a
李宝城
microprocessor or microcontroller. Proper decoupling of the power supply is recommended.
Figure 4 shows the nsor output signal relative to pressure input. Typical, minimum, and maximum output curves are shown for operation over a temperature range of 10° to 60°C using the decoupling circuit shown in Figure 3. The output will saturate outside of the specified pressure range.
Figure 2. Cross-Sectional Diagram SOP
(not to scale)
Figure 3. Recommended Power Supply Decoupling
and Output Filtering
(For additional output filtering, plea refer to
Application Note AN1646.)
Figure 4. Output versus Pressure Differential
Fluoro Silicone Gel Die Coat
Wire Bond Die
P1
Stainless Steel Cap
Thermoplastic
Ca
Die Bond
Differential Sensing
Element
P2
+5 V
1.0 µF
0.01 µF
菏泽旅游
470 pF
GND
V s
V out
IPS
OUTPUT
Lead Frame
Differential Pressure (kPa)
O u t p u t V o l t a g e (V )
5.0
4.03.0
2.01.00
2
TYPICAL
MIN
-2-11Transfer Function:
V out = V S × (0.2 × P(kPa)+0.5) ± 6.25% V FSS V S = 5.0 Vdc T A = 10 to 60°C
MAX
MPXV7002Sensors
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Freescale designates the two sides of the pressure nsor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing a gel die coat which protects the die from harsh media.
The Pressure (P1) side may be identified by using the table below:
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the correct size to ensure proper solder connection interface between the board and the package. With the correct
footprint, the packages will lf align when subjected to a solder reflow process. It is always recommended to design boards with a solder mask layer to avoid bridging and shorting between solder pads.
Figure 5. Small Outline Package Footprint
Part Number
Ca Type Pressure (P1)Side Identifier
MPXV7002GC6U/GC6T1482A-01Vertical Port Attached MPXV7002GP 1369-01Side with Port Attached MPXV7002DP
1351-01
Side with Dual Port Attached
0.66016.76
0.060 TYP 8X 1.52
0.100 TYP 8X 2.54
0.100 TYP 8X 2.54
0.3007.62
inch mm
SCALE 2:1
PACKAGE DIMENSIONS
ISSUE A
SMALL OUTLINE PACKAGE
MPXV7002 Sensors
