DRV8840
SLVSAB7C–MAY2010–REVISED AUGUST2013
DC MOTOR DRIVER IC
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FEATURES•8.2-V to45-V Operating Supply Voltage Range
•Thermally Enhanced Surface Mount Package •Single H-Bridge Current-Control Motor Driver
–Drives One DC Motor
APPLICATIONS
–Brake Mode
•Printers
–Five-Bit Winding Current Control Allows Up
•Scanners
to32Current Levels弥天大罪
•Office Automation Machines –Low MOSFET On-Resistance
•Gaming Machines
•5-A Maximum Drive Current at24V,25°C
•Factory Automation
•Built-In3.3-V Reference Output
•Robotics
•Industry-Standard Parallel Digital Control
Interface
DESCRIPTION
The DRV8840provides an integrated motor driver solution for printers,scanners,and other automated equipment applications.The device has one H-bridge driver,and is intended to drive one DC motor.The output driver block for each consists of N-channel power MOSFET’s configured as full H-bridges to drive the motor windings.The DRV8840can supply up to5-A peak or3.5-A output current(with proper heatsinking at24V and 25°C).
A simple parallel digital control interface is compatible with industry-standard devices.Decay mode is programmable to allow braking or coasting of the motor when disabled.
Internal shutdown functions are provided for over current protection,short circuit protection,under voltage lockout and overtemperature.
TheDRV8840is available in a28-pin HTSSOP package with PowerPAD™(Eco-friendly:RoHS&no Sb/Br).
ORDERING INFORMATION(1)
ORDERABLE PART TOP-SIDE T A PACKAGE(2)
NUMBER MARKING –40°C to85°C PowerPAD™(HTSSOP)-PWP Reel of2000DRV8840PWPR8840
(1)For the most current packaging and ordering information,e the Package Option Addendum at the end of this document,or e the TI
独角兽卡通web site at
(2)Package drawings,thermal data,and symbolization are available at /packaging.
Plea be aware that an important notice concerning availability,standard warranty,and u in critical applications of
Texas Instruments miconductor products and disclaimers thereto appears at the end of this data sheet.
PowerPAD is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.Copyright©2010–2013,Texas Instruments Incorporated Products conform to specifications per the terms of the Texas有关法律的手抄报
Instruments standard warranty.Production processing does not
necessarily include testing of all parameters.
DRV8840
SLVSAB7C–MAY2010–REVISED
DEVICE INFORMATION
Functional Block Diagram
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DRV8840 SLVSAB7C–MAY2010–REVISED AUGUST2013
屏嶂
Table1.TERMINAL FUNCTIONS
EXTERNAL COMPONENTS NAME PIN I/O(1)DESCRIPTION
OR CONNECTIONS
POWER AND GROUND
GND14,28-Device ground
Connect to motor supply(8.2-45V).Both
《小公主》
VM4,11-Bridge A power supply
pins must be connected to same supply.
对口单招是什么意思
Bypass to GND with a0.47-μF,6.3-V ceramic V3P3OUT15O 3.3-V regulator output
capacitor.Can be ud to supply VREF.
CP11IO Charge pump flying capacitor Connect a0.01-μF50-V capacitor between
CP1and CP2.
CP22IO Charge pump flying capacitor
Connect a0.1-μF16-V ceramic capacitor and VCP3IO High-side gate drive voltage
a1-MΩresistor to VM.
CONTROL
单翼天使Logic high ts OUT1high,OUT2low. PHASE20I Bridge pha(direction)
Internal pulldown.
Logic high to enable H-bridge.Internal
ENBL21I Bridge enable
pulldown.
I023I
I124I
Sets winding current as a percentage of full-
在线英文签名
I225I Current t inputs
scale.Internal pulldown.
I326I
I427I
Low=brake(slow decay),high=coast(fast DECAY19I Decay(brake)mode
decay).Internal pulldown and pullup.
Active-low ret input initializes the logic and nRESET16I Ret input disables the H-bridge outputs.Internal
pulldown.
Logic high to enable device,logic low to enter nSLEEP17I Sleep mode input
low-power sleep mode.Internal pulldown.
Reference voltage for winding current t. VREF12,13I Current t reference input Both pins must be connected together on the
PCB.
STATUS
Logic low when in fault condition(overtemp, nFAULT18OD Fault
overcurrent)
OUTPUT
Connect to current n resistor.Both pins ISEN6,9IO Bridge ground/In
must be connected together on the PCB.
Connect to motor winding.Both pins must be OUT15,10O Bridge output1
connected together on the PCB.
Connect to motor winding.Both pins must be OUT27,8O Bridge output2
connected together on the PCB.
(1)Directions:I=input,O=output,OZ=tri-state output,OD=open-drain output,IO=input/output
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GND I4I3I2I1I0NC ENBL PHASE DECAY nFAULT nSLEEP nRESET V3P3OUT
VREF GND
VM VREF ISEN OUT1OUT2OUT2OUT1ISEN VCP VM CP1CP2PWP PACKAGE (TOP VIEW)
DRV8840
SLVSAB7C –MAY 2010–REVISED AUGUST 2013
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwi noted)
(1)(2)
VALUE UNIT VMx Power supply voltage range –0.3to 47V Digital pin voltage range –0.5to 7V VREF
Input voltage –0.3to 4V ISENSEx pin voltage
–0.3to 0.8V Peak motor drive output current,t <1μS Internally limited
A Continuous motor drive output current (3)
5A Continuous total power dissipation
See Dissipation Ratings table
T J Operating virtual junction temperature range –40to 150°C T A Operating ambient temperature range –40to 85°C T stg Storage temperature range
–60to 150
°C
(1)Stress beyond tho listed under absolute maximum ratings may cau permanent damage to the device.The are stress ratings only,and functional operation of the device at the or any other conditions beyond tho indicated under recommended operating conditions is not implied.Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability.(2)All voltage values are with respect to network ground terminal.(3)
Power dissipation and thermal limits must be obrved.
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DRV8840 SLVSAB7C–MAY2010–REVISED AUGUST2013
THERMAL INFORMATION
DRV8840
THERMAL METRIC(1)PWP UNITS
28PINS
θJA Junction-to-ambient thermal resistance(2)31.6
θJCtop Junction-to-ca(top)thermal resistance(3)15.9
θJB Junction-to-board thermal resistance(4) 5.6
°C/W
ψJT Junction-to-top characterization parameter(5)0.2
ψJB Junction-to-board characterization parameter(6) 5.5
θJCbot Junction-to-ca(bottom)thermal resistance(7) 1.4
(1)For more information about traditional and new thermal metrics,e the IC Package Thermal Metrics application report,SPRA953.
(2)The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard,high-K board,as
specified in JESD51-7,in an environment described in JESD51-2a.
(3)The junction-to-ca(top)thermal resistance is obtained by simulating a cold plate test on the package top.No specific JEDEC-
standard test exists,but a clo description can be found in the ANSI SEMI standard G30-88.
(4)The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB
temperature,as described in JESD51-8.
(5)The junction-to-top characterization parameter,ψJT,estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtainingθJA,using a procedure described in JESD51-2a(ctions6and7).
(6)The junction-to-board characterization parameter,ψJB,estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtainingθJA,using a procedure described in JESD51-2a(ctions6and7).
(7)The junction-to-ca(bottom)thermal resistance is obtained by simulating a cold plate test on the expod(power)pad.No specific
JEDEC standard test exists,but a clo description can be found in the ANSI SEMI standard G30-88.
RECOMMENDED OPERATING CONDITIONS
over operating free-air temperature range(unless otherwi noted)
MIN NOM MAX UNIT
V M Motor power supply voltage range(1)8.245V
V REF VREF input voltage(2)1 3.5V
I V3P3V3P3OUT load current01mA
f PWM Externally applied PWM frequency0100kHz
(1)All V M pins must be connected to the same supply voltage.
(2)Operational at VREF between0V and1V,but accuracy is degraded.
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