专利名称：Ceramic lamination circuit substrate 发明人：篠原 浩一，鈴木 秀夫，荻原 覚，荒川 英夫
申请号：JP特願昭63-143350
申请日：19880610
公开号：JP第2610487号B2
公开日：
19970514
专利内容由知识产权出版社提供
摘要：PURPOSE:To obtain a ceramic laminated circuit substrate which is low in dispersion of burning shrinkage and in porosity in the substrate by forming a fiber composite ceramic insulating layer containing a fiber in its layer. CONSTITUTION:A fiber composite green sheet 21A is manufactured by adding at least a kind of fibers out of the fibers such as a whisker, glass filament, and chopped strand 1A to the material of a green sheet 21 and the above green sheet is laminated so that its casting direction has a different direction and then, a substance 24 laminated to a green sheet 21B which does not contain the fibers is formed after burning it. An insulating layer thus prevents burning shrinkage in the laminating direction of a ceramic insulation layer which does not contain the fibers by adding at least a layer of the fiber composite ceramic insulating layer to a laminated substance as a laminating layer or layers and further, prevents shrinkage in the surface direction of a ceramic laminated circuit substrate 30. In addition, as the insulating layer which does not contain the fibers is susceptible to burning shrinkage in the direction of thickness, the substrate shrinks in the above direction and porosity in the substrate decreas accordingly.
申请人：株式会社日立製作所
地址：東京都千代田区神田駿河台4丁目6番地
国籍：JP
代理人：鵜沼 辰之 (外1名)更多信息请下载全文后查看
