PCB 制作规范
Purchasing Specification for PWB
Page
1.0 範圍(Scope) (2)
2.0 基本要求(General Requirements) (2)
3.0 線路完整性(Pattern Integrity) (5)
4.0 孔穴規範( Hole Integrity) (13)
5.0 鍍層規範(Plating) (19)
6.0 防焊(Solder Mask) (24)
7.0 文字印刷要求 (Legend ) (28)
8.0標示( Marking) (29)
9.0 V 型切槽( V-CUT ) & PUSH BACK (30)
10.0 光學點 (Fiducial Mark) (31)
11.0 包裝(Packing) (32)
12.0 信賴性試驗規範(Reliability test Specification) (33)
13.0 外型尺寸及誤差 (Dimensions and Tolerances) (34)
14.0 板面清潔度(Cleanliness) (37)
1.0 範圍(Scope)
1.1 本規範適用於所有硬性樹脂基材之單面，雙面及多層PWBs 之基本要求,
凡本公司所用之上述PWBs 板均須符合此規範要求。
This specification shall be applied to all single-sided, double-sided and multi-layer of rigid printed circuit boards.
1.2 本規範未列舉項目概以IPC-6012, IPC-A-600 最新版class2 等級及MIL-P-55110
2.0 基本要求(General Requirements)
2.1 所用之等級，型號，依本公司工程規格指定。
The ANSI class style of laminate should follow DELTA’s individual engineering specification.
2.2 須有UL 認可，防火等級在94V-0 且附有證明者。
PWB shall be UL approved, flame retardant conform to 94V-0 and register in UL licen.
2.3 UL 認可耐溫等級(M.O.T)須為130℃或更好的。
The maximum operating temperature shall be 130℃or more than better.
2.4 UL 認可耐熱漂錫性必須符合溫度≧260℃且時間≧5 秒以上.
Solder Resist limits shall be UL approved and meet the temperature≧ 260℃for 5cs min.
2.5 介質(絕緣材料)起碼厚度若無明確規定其隔離尺度時，至少要≧0.09mm(
3.5mil)
以上，介質厚度計算以牙底至牙底(如Fig.1).
If not specified, the minimum dielectric thickness shall be 0.09mm.
2.6 介質層除特別規定外，疊層最少為2 張P.P。
If not otherwi specification the Dielectric shall be 2 ply .
2.7 PWB 應為原色,不得有焦黑,異色之現象。
PWB shall not discolors, any burn and weird color are not acceptable.
2.8 PWB 出現空泡，分層，白圈之現象須符合如下要求:
In the event of Blistering, Delamination and Haloing in PWB, it must
conform it as following:
◎缺點為不導電性的.
The fault does not conductance.
◎在導体間或通孔間尚未超過其間距之25%且出現面積不可超過每個板面1%。
There shall be no more than 25% reduction in space between conductors and
at the center through holes, Total board area affected shall not exceed 1% on
each side.
◎缺點經各項測試後未擴散者。
No propagation as a result of testing.
2.9 板面不得有金屬性物質陷入。
Plate surface shall be free from metallic matter.
2.10 板邊拉料不得深入超過一個板厚度，或造成線路下層懸空。
Edges are rough put not over one PWB thickness, or to cau happen trace damage.
2.11 板面不得有雜質，油脂，指印，殘餘助焊劑或其他污染物。
The surface of PWB should be free from dirt oil corrosion, fingerprint or other pollutants. 2.12 銅箔不得與PWB 脫離(Separation)
Copper foil shall stick to the PWB at all time.
2.12.1 壓合空洞須≦0.08mm 且未違反介質起碼間距。
Laminate voids are≦0.08mm and does not violate minimum dielectric spacing.
2.12.2 金屬層對通孔壁所讓出的間距不得小於0.1mm。
Metal plane tback is equal to or greater than 0.1mm.
2.12.3 內層板不得出現分層或起泡現象。
No evidence of de-lamination or blistering.
2.13 PWB 針孔，凹陷，刮痕，織紋顯露，白點，白斑之現象須符合如下要求:
In the event of Pin hole, Dents, Scratches, Weave exposure, Measling and Crazing
characteristics occur in PWB shall comply to the following below:
2.1
3.1 PWB 中纖維未被切斷，擾亂且纖維未裸露者。
The fiber in PWB do not parate or disrupted or expod.
2.1
3.2 在兩導體間尚未搭連且符合起碼間距要求。
Defect shall no involves two parate conductor and shall not reduce the min.
conductor spacing requirements.
2.1
3.3 導體間或兩缺點間之介質未影響原要求。
Between conductor and defect does not interfere with requirement.
2.1
3.4 經組裝製程不可有擴大現象。
No propagation and degeneration after thermal process.
2.1
3.5 白點或白斑不可於不同電位區之導體間。
Measling or crazing cannot be at different electric potential conductors.
2.14 毒性(Toxicity)
PWB 本身必須滿足職業健康的需求﹐在製造過程中不能釋放有害的危險物
質。
PWB shall fulfill the requirements t by Occupational health
authorities. Printed boards shall not discharge harmful amounts of dangerous substance, vapor or gas during the manufacturing process.
2.15 抗化學性(Chemical Resistance)
PWB 在水溫 60℃±5℃的溶劑( NaOH)中浸泡不得溶解﹐且顏色不得改變。
The PWB shall remain unchanged, insoluble and without color change when expod to the solvent that the water of 60℃±5℃.
2.16 機械能力(Machine Ability)
PWB 必須能被正常加工﹐如：鑽孔﹐撈板﹐鋸開﹐切割﹒且適於一般組合 過錫爐及清潔的製程。
The PWB shall be machine-able with normal methods, for example drilling, routing, sawing, and cutting.
The printed circuit boards shall be compatible with the general asmbling soldering and cleaning methods.
2.17 電性要求(Electrical Requirements)
2.17.1 介質耐電壓(Dielectric Withstanding Voltages)
Test condition ：500 Vdc 30 c per IPC-TM-650 2.5.7
2.17.2 表面絕緣電阻(到貨)Surface Insulation Resistance (As Received)
Test condition ：greater than 500 Mega ohm at 50°C for 24 hours per IPC-TM-650
2.6.
3.7
2.17.3 電路連通性與絕緣性(Electrical Continuity and Isolation Resistance)
(per IPC-9252)
Test condition ：
Test Voltage ：Minimum 200 VDC Continuity (open) Resistance: Maximum 50 ohms Isolation (short) Resistance: Minimum 10 Mega ohms
Test frequency ：100% open/short test and net list testing are required.
3.0 線路完整性(Pattern Integrity):
3.1 線路 TRACE
3.1.1
3.1.2
成品線路寬度變化不得大於該線路寬之 20%或±0.125mm,(取其輕者), 設計原稿最細線寬要求如 Table 1 . Changes in trace width shall not exceed 20% of its width or +/- 0.125mm
(whichever less),The minimum design wide in accordance with Table 1. 成品兩導線間距變化不得大於該間距之 20%或±0.125mm(取其輕者), 設計原稿最小間距要求如 Table 1 .
Changes in the distance between two conductors should not exceed 20% or
+/-0.125mm(whichever less),The minimum design spacing in accordance with Table1
外層(External Layer ) Table 1
內層(Inner Layer)
Style
Copper Weight Minimum wide Minimum space (Finished process)
0.5 oz 0.075mm/3mil 0.075mm/3mil 1 oz
0.10mm/4mil 0.10mm/4mil 2 oz 0.15mm/6mil 0.15mm/6mil 3 oz 0.20mm/8mil 0.25mm/10mil 4 oz 0.25mm/10mil 0.30mm/12mil Multi-Layers
5 oz &
6 oz
0.30mm/12mil
0.35mm/14mil
3.1.3 線路不得有斷、短路現象出現。
Trace should be continuous and does not have short characteristic.
3.1.4 線路缺損(Void ,Nicks ,Notches)
◎其缺損寬度或長度為導體寬度之 20%以內或 1mm 兩者取其輕者。
Damage width or length should not exceed 20% conductor’s width or 1mm which ever less.
◎一條導體內至多容許一個缺點﹐在100mm*100mm 單位面積下僅容許 3
處出現缺點。
Each conductor shall only have one fault. In an area of 100mm*100mm shall only allow 3 faults.
3.1.5 線路凸出(Projection & Protrusion):
◎在不影響 Safety 規格下，凸出部份不得使原間距減少 20%。
In condition where safety criterion are not effected, projection shall not reduce more than 20% of the spacing.
◎線路凸出不可違背最小間距之要求。
Trace projection shall not exceed of the minimum spacing requirement.
Style
Copper Weight(Finished process) Minimum wide
Minimum space 0.5 oz 0.12mm/5mil 0.12mm/5mil 1 oz 0.15mm/6mil 0.15mm/6mil 1.5oz & 2 oz 0.15mm/6mil 0.20mm/8mil Double side 3 oz & 4 oz 0.25mm/10mil 0.30mm/12mil 5 oz & 6 oz 0.30mm/12mil 0.35mm/14mi 1 oz 0.20mm/8mil 0.20mm/8mil Sigle Side 2 oz
0.25mm/10mi
0.25mm/10mi
