1Scope This test is performed for the purpo of determin-ing whether plated-through holes can withstand the thermo-dynamic effects of the extreme heat to which they may be expod during the asmbly,rework,or repair process.
2Applicable Documents
J-STD-001Requirements for Soldered Electrical and Elec-tronic Asmblies
J-STD-004Requirements for Soldering Fluxes
IPC-2221Generic standard on Printed Board Design
IPC-TM-650Test Methods Manual
2.1.1Microctioning
2.1.1.2Microctioning–Semi or Automatic Technique
Microction Equipment(Alternate)
3Test Specimen
3.1The test specimen shall be a printed board,a portion of
a printed board or a test coupon as described in IPC-2221, which allows for microction evaluation of both the largest component holes and the smallest holes on the board.
3.2The test specimen shall be removed from a printed board or test coupon as specified in IPC-TM-650,Method 2.1.1or Method2.1.1.2,prior to precondition bake.
4Apparatus or Material
4.1Drying oven capable of maintaining a uniform tempera-ture between121C to149°C[250°F to300°F].
4.2Solder pot,electrically heated,thermostatically con-trolled,of sufficient size,containing at least0.9kg of Sn60Pb40or Sn63Pb37solder conforming to the contami-nant level specified in J-STD-001.
4.3Thermocouple indicator or other devices to measure the solder temperature19mm±6.4mm[0.748in±0.252in] below the surface.
4.4Desiccator with suitable desiccant.
4.5Microscope(100X to200X magnification).4.6Stop Watch or Timer.
4.7Rosin Flux,type ROL1per J-STD-004,or flux agreed upon between customer and vender.
4.8Tongs.
4.9Suitable solvent for flux removal following the thermal stress such as isopropyl alcohol.
5Procedure
5.1The test specimen shall be conditioned by drying in an oven for an appropriate period at121°C to149°C[250°F to 300°F]to remove the moisture in the specimen.For referee purpos,a dry for a minimum of six hours at121°C to 149°C[250°F to300°F]shall be ud.Thicker or more com-plex specimens may require longer baking times.
5.2Place the test specimen in a desiccator on a ceramic plate to cool to room temperature.
5.3Remove the test specimen from the desiccator using tongs.Flux coat the surface and plated-through holes to insure solder filling.
5.4Verify that the temperature of the solder(at a probe depth of19mm±
6.4mm[0.748in±0.252in]from the sur-face of the solder)is maintained at one of the following speci-fied test conditions(e6.1):
(a)Test Condition A(default)288°C±5°C[550°F±9°F]
(b)Test Condition B260°C±5°C[500°±9°F]
(c)Test Condition C232°C±5°C[450°F±9°F]
5.5Remove the dross from the solder pot surface and lay the test specimen on the solder for10conds+1,-0c-onds(e
6.2).
5.6Using tongs,carefully remove the test specimen from the solder and place it on a piece of insulator to cool to room temperature(e
6.3).
5.7Evaluation
Material in this Test Methods Manual was voluntarily established by Technical Committees of IPC.This material is advisory only
and its u or adaptation is entirely voluntary.IPC disclaims all liability of any kind as to the u,application,or adaptation of this
material.Urs are also wholly responsible for protecting themlves against all claims or liabilities for patent infringement.
Equipment referenced is for the convenience of the ur and does not imply endorment by IPC.
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5.7.1
After cleaning,microction the specimen as defined
in IPC-TM-650,Method 2.1.1or Method 2.1.1.2.
5.7.2Examine the microction for compliance of the
plated-through holes to the applicable performance specifica-tion requirements.Any nonconformities shall be noted.
6.Notes 6.1
Performance specifications should specify the test con-dition and any deviations to this test method.If no test condi-tion is specified,u Test Condition A.
6.2
The test specimen is not to be held against the surface of the molten solder.
6.3
Do not physically shock specimen while the solder in the plated-through holes is still liquid.
IPC-TM-650
Number 2.6.8Subject
Thermal Stress,Plated-Through Holes
Date 05/04
Revision E
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