pcb制作过程（PCB production process）
This article is contributed by heyelv0753
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PCB flow introduction
Teaching and training materials
Zero
PCB manufacturing process
Gu disk, tape (DISK, M/T) film (MASTER A/W) industry customer rvice (CUSTOMER) (SALES DEPARTMENT) chart production management (P&M CONTROL) (LAMINATE SHEAR) cutting board surface (DRAWING) screen production (STENCIL) drilling machine, (D. N. C.) - (PROGRAM) project before (FRONT-END DEP.) (WORKING A/W) film work specification (RUN CARD)
Data transfer (MODEM, FTP) blueprint (DRAWING)
MLB
Inner layer dry film (INNERLAYER, IMAGE) corrosion
PRODUCT LAYER (INNER)
DOUBLE SIDE
The expod light (EXPOSURE) film (STRIPPING), pressure corrosion film (LAMINATION), copper (ETCHING)
TREATMENT (PRELIMINARY)
Copper (I/L, ETCHING)
Show
Shadow (DEVELOPIG)
A O I (AOI INSPECTION) to check the pre stack and stack (LAY- UP) pre stack and stack (LAY- UP) postprocessing (POSTTREATMENT) (BAKING) and baking baking pressure (LAMINATION) blacken
ing treatment (BLACK OXIDE)
Blinded Via
Lar drilling (LASER, ABLATION)
The drill hole plate electric pressure
Plated (LAMINATION) hole (PTH, DRILLING) plated (P. T. H.) plated (PANEL, PLATING)
Through hole plating (E-LESS, CU)
Removal of slag (DESMER)
TREATMENT (PRELIMINARY)
abroad
Layer
System
Do (OUTER-LAYER)
Outer layer of dry film (OUTERLAYERIMAGE)
Exposure
Light (EXPOSURE)
Pressure
Membrane (LAMINATION)
TREATMENT (PRELIMINARY)
TENTING PROCESS
Two copper and tin lead plating (PATTERN, PLATING) corrosion detection liquid printed S/M O/L (ETCHING) check (INSPECTION) welding (LIQUID)
Tin Lead electroplating (T/L, PLATING) stripping tin lead (T/L, STRIPPING)
Two times copper plating (PATTERNPLATING), etching copper
(ETCHING) and removing film (STRIPPING)
TREATMENT (PRELIMINARY)
Coating printing (S/M, COATING) developing (DEVELOPING)
Pre drying (PRE-CURE) exposure (EXPOSURE)
After baking (POST CURE)
S/G (SCREEN, LEGEND), tin (HOT, AIR, LEVELING), PLATING (FINAL, SHAPING), TEST (ELECTRICAL), gold plated finger (G/F, PLATING), electroless nickel gold (E-less, Ni/Au), nickel plated gold (silver nickel)
選擇性鍍鎳鍍金（选择性金）
噴成電
为O. S. P.
外觀檢查（目测）出貨前檢查（O Q C）銅面防氧化處理（O S P（Entek 铜106a）
一
包裝出貨（包装）
（1）前製程治工具製作流程
顧客
客户
磁片磁帶
磁盘
業
務
圖
面網版製作
模板鑽孔，成型機D. C. 销售部
图
底
片工程製前
前端部
工作底片
工作/ W
