ipc标准

IPCDocumentRevisionTable

IPC标准、文件一览表

UpdatedMay24,2000

IPCDOC#

TITLE

Page1of18

PUBLICATION/REVISIONDATES

(IPC文件

号)

Roadmap

(指南)

SMC-TR-

001

名称

NationalTechnologyRoadmapforElectronicInterconnections

(美国国家电子互联技术指南)

出版/修订日期

6/95(.)

SMTAnIntroductiontoTapeAutomatedBonding&Fine

1/89(.)

PitchTechnology(TAB和细间距SMT介绍)

4/92(.)

Revision:A1/95

Amendment1:3/96

RevisionB:10/96RevisionC:3/00

J-STD-001RequirementsforSolderedElectricalandElectronic

Asmblies

代替

IPC-

(电气、电子组件焊接技术要求)

S-815

HandbookandGuidetotheRequirementsforSoldered

ElectricalandElectronicAsmbliestoSupplementJ-STD-001B

(J-STD-001B学习辅导书)

J-STD-002SolderabilityTestsforComponentLeads,Terminations,

Lugs,TerminalsandWires(元件引线,焊端,接线端和导

线的可焊性

代替

IPC-

S-805

测试)

J-STD-003

SolderabilityTestsforPrintedBoards(印制板可焊性测

试)

IPC-

HDBK-001

3/98(.)

4/92(.)A10/98

代替

IPC-

S-804

J-STD-004

4/92(.)

RevisionA:Inprocess

1/95(.)

Amendment1-4/96RevisionA:Inprocess

代替

IPC-

SF-818

J-STD-005

RequirementsforSolderingFluxes(助焊剂技术要求)

代替

IPC-

SF-819

RequirementsforSolderingPastes(焊膏技术要求)

1/95(.)Amendment1-1/95

J-STD-006RequirementsforElectronicGradeSolderAlloysand

FluxedandNon-FluxedSolidSoldersforElectronicSolderingApplications

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PDF文件使语文学习总结 用"pdfFactoryPro"试用版本创建

1/95(.)

Amendment1-6/96RevisionA:Inprocess

2011-3-4

IPCDocumentRevisionTable

(电子级固态焊料技术要求)

ImplementationofFlipChipandChipScaleTechnology

J-STD-012

(FC和CSP器件的安装)

J-STD-013

IPC-DRM-

18

ImplementationofBallGridArrayandOtherHigh

DensityTechnology(BGA和HDI器件的安装)

ComponentIdentificationDeskReferenceManual

(元器件封装辨认手册)

Page2of18

1/96(.)

7/96(.)

9/95(.)

RevisionA:4/96

RevisionB:2/97

RevisionC:7/98

October1996(.)

RevisionA:3/99

Moisture/ReflowSensitivityClassificationofPlastic

J-STD-020SurfaceMountDevices(塑封表面器件对潮湿和再流焊

的敏感度要求)Through-HoleSolderJointEvaluationDeskReference

IPC-DRM-Manual

40

(通孔引线焊点评估参考手册)SurfaceMountSolderJointEvaluationDeskReference

IPC-DRM-

Manual

SMT

(表面组装焊点评估参考手册)

8/98

8/75(.)

A-8/76

B-6/80

C-3/85

D-11/88

E-7/92F-6/96

4/87(.)

RevisionA:Inprocess7/95(.)

IPC-T-50

TermsandDefinitionsInterconnectingandPackaging

ElectronicCircuits(电子电路互连及封装术语和定义)

IPC-SC-60

IPC-SA-61

PostSolderSolventCleaningHandbook(焊后溶剂清洗

手册)

Post-SolderSemi-AqueousCleaningHandbook

(焊后半水清洗手册)

IPC-AC-62

IPC-CH-65

PostSolderAqueousCleaningHandbook(焊后水清洗手

册)

GuidelinesforCleaningofPrintedBoardsandAsmblies

(印制板及其组件清洗导则)

12/86(.)12/90(.)

RevisionA:Inprocess

IPC-CS-70

IPC-CM-78

GuidelinesforChemicalHandlingSafetyinPrintedBoard

8/88(.)

Manufacturing(印制板制造化学处理安全准则)

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2011-3-4

IPCDocumentRevisionTablePage3of18

被

IPC-

SM-780替

代

IPC-MP-

83

IPC-PC-90

GuidelinesforSurfaceMountingandInterconnectingChipCarriers

IPCPolicyonMetrication(IPC公制化导则)

GeneralRequirementsforImplementationofStatistical

ProcessControl(实施SPC的总技术规范)

11/83(.)

C-3/88

8/85(.)

10/90(.)

4/93(.)

3/76(.)

A10/80

B6/90

3/76(.)

A10/80

B7/92A

1/94(.)RevisionA:12/97

GeneralRequirementsforImplementationofISO9000

IPC-QS-95

QualitySystems(实施ISO9000质量体系的总技术规

范)

IPC-L-108

被IPC-

4101

替代

IPC-L-109

SpecificationforThinMetalCladBaMaterialsforMultilayerPrintedBoards

被

IPC-

4101替代

SpecificationforResinImpregnatedFabric(Pregreg)forMultilayerPrintedBoards

IPC-L-110Preimpregnated,B-StageEpoxy-GlassClothfor

(已作废)MultilayerPrintedCicuitBoards

IPC-CC-

110

GuidelinesforSelectingCoreConstructionsfor

被

IPC-

MultilayerPrintedWiringBoardApplications

4121

替代

IPC-L-112

SpecificationforCompositeMetalCladBamaterialsfor7/81(.)

被

IPC-

PrintedBoardsA6/92

4101替代

IPC-L-115

SpecificationforRigidMetalCladBaMaterialsfor

被

IPC-PrintedBoards

4101替代

IPC-L-120InspectionProcedureforChemicalProcessingSuitability

(

己作废

)ofCopper-CladEpoxy-GlassLaminates

IPC-L-125

IPC-L-130

(

已作废

)

SpecificationsforPlasticSubstratesCladorUncladfor

HighSpeed/HighFrequencyInterconnections

(高速/高频塑性基板特性规范)

SpecificaitonsforThinLaminates,MetalClad,PrimarilyforGeneral-PurpoMultilayerPrintedBoards

3/77(.)

A10/80

B4/90

8/83(.)A7/92

1/77(.)

被

IPC-L-

108替代

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2011-3-4

IPCDocumentRevisionTable

IPC-EG-

140

IPC-SG-

141

IPC-A-142

IPC-QF-

143

IPC-CF-

148

SpecificationforFinishedFabricWovenfrom"E"Glass

forPrintedBoards("E"纤维织物印制板特性规范)

SpecificationforFinishedFabricWovenfrom"S"Glass

forPrintedBoards("S"纤维织物印制板特性规范)

Page4of18

3/88(.)

A6/97*2/92(.)

SpecificationforFinishedFabricWovenfromAramidfor

6/90(.)

PrintedBoards(Aramid纤维织物印制板特性规范)

GeneralSpecificationforFinishedFabricWovenfrom

Quartz(PureFudSilica)forPrintedBoards

(石英纤维织物印制板特性规范)

ResinCoatedMetalforPrintedBoards(印制板涂树脂金

属箔)

6/90(.)

A9/98

8/66(.)

A9/67

B2/71

C8/74

D3/76E5/81

F10/91,8/92

G5/99

6/90(.)

A1/94

B3/98

7/85(.)2/92(.)

IPC-MF-

150

MetalFoilforPrintedWiringApplications

(印制线路金属箔)

IPC-CF-

152

IPC-FC-

203

(已作废)

IPC-FC-

210

(

已作废

)

IPC-FC-

213

(

已作废

)

IPC-FC-

217

(

已作废

)

IPC-FC-

218B/

EIA-RS-

429

(

已作废

)

IPC-FC-

219

CompositeMetallicMaterialSpecificationforPrinted

WiringBoards(印制板复合金属材料特性规范)

SpecificationforFlatCable,RoundConductor,GroundPlane

PerformanceSpecificationforFlat-ConductorUndercarpetPowerCable(TypeFCC)

9/85(.)

PerformanceSpecificationforFlatUndercarpetTelephone

9/84(.)

Cable

GeneralDocumentforConnectors,Electric,Header,

Receptacle,InsulationDisplacementforUwithRoundConductorFlatCable

GeneralSpecificationforConnectors,ElectricalFlatCableType

8/82(.)

Reaffirmed4/90

7/76(.)

Reaffirmed11/81Reaffirmed05/91

EnvironmentSealedFlatCableConnectorsforuin

2011-3-4

file://E:RDipc标准IPC标准（new）IPC标准一览表.html

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IPCDocumentRevisionTable

(已作废)

IPC-FC-

220

(

已作废

)

IPC-FC-

221

(

已作废

)

IPC-FC-

222

(

已作废

)

IPC-FC-

225

(

已作废

)

IPC-FC-

231

IPC-FC-

232

SpecificationforFlat-CopperConductorsforFlatCablesAerospaceApplications

Page5of18

5/84(.)

5/70

A1/74

B8/75

C7/85

8/75(.)

A5/84

6/80(.)

5/91Reaffirmed

8/75(.)

10/85Reaffirmed

.7/74

A5/83

B2/86C4/92

Amendment10/95

SpecificationforFlatCable,FlatConductor,Unshielded

SpecificationofFlatCableRoundConductor,Unshielded

FlatCableDesignGuide

FlexibleBaDielectricsforUinFlexiblePrintedWiring

(柔性印制线路的绝缘基材)

代替

IPC-

FC-233A

IPC-FC-

233

(

作废

)

IPC-FC-

241

IPC-RF-

245

被IPC-

6013

替代

AdhesiveCoatedDielectricFilmsforUasCoverSheets7/74(.)

A5/83

forFlexiblePrintedWiringandFlexibleBondingFilms

B2/86C4/92

(柔性电路绝缘涂覆胶粘剂)

Amendment10/95-

IncorporatedintoIPC-

FC-232B7/74(.)

A5/83

B2/86C4/92

Amendment10/95

FlexibleMetal-CladDielectricsforUinFabricationof

FlexiblePrintedWiring(柔性印制电路镶嵌金属夹层的

绝缘基材)

PerformanceSpecificationforRigid-FlexPrintedBoards4/87(.)

IPC-D-249

被

IPC-DesignStandardforFlexibleSingle-andDouble-Sided

2223

PrintedBoards

1/87(.)

替代

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2011-3-4

IPCDocumentRevisionTable

IPC-FC-

250A

被

IPC-

6013

Page6of18

SpecificationforSingle-andDouble-SidedFlexible

PrintedWiring

9/86(.)A9/86

替代

GuidelinesforSingleandDoubleSidedFlexCircuits

2/92(.)

(单、双面柔性电路指南)

IPC-FA-

251

IPC-D-275

被

IPC-

2221and

DesignStandardforRigidPrintedBoardsandRigid

2222PrintedBoardAsmblies

9/91(.)

Amend.14/96

替代

IPC-RB-

276

被IPC-

QualificationandPerformanceSpecificationforRigid

6011和

PrintedBoards

IPC-6012

替代

DesignGuidelinesforReliableSurfaceMount

TechnologyPrintedBoardAsmblies

(可靠的印制板SMT设计指南)

8/60(.)

A7/61

B1/64

C10/65

D1/70E10/70

F11/74Editorial

revision

G1/84

9/69(.)

A12/77

B12/85C06/91

3/92(.)

IPC-D-2797/96(.)

PrintedBoardDimensionsandTolerances

IPC-D-300

(印制板的尺寸和容差)

IPC-D-310

GuidelinesforPhototoolGenerationandMeasurement

Techniques(照相底板生成和测量技术指南)

ProcessControlGuidelinesforPhototoolGenerationand

IPC-A-311U

(照相底板生成和使用过程的控制指兔子的家常做法 南)

file://E:RDipc标准IPC标准（new）IPC标准一览表.html

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3/96(.)

2011-3-4

IPCDocumentRevisionTable

IPC-D-316

Page7of18

DesignGuideforMicrowaveCircuitBoardsUtilizingSoft

5/95(.)

Substrates(软质基材的微波电路设计指南)

4/90()A1/95

DesignGuidelinesforElectronicPackagingUtilizing

IPC-D-317High-SpeedTechniques(电子封装用于高速技术的设计

指南)

IPC-HF-

318

被

IPC-

6018

MicrowaveEndProductBoardInspectionandTest

6/85(.)A12/91

替代

IPC-D-319DesignStandardforRigidSingle-andDouble-Sided

(

作废

)PrintedBoards

IPC-D-

320A

(

作废

)

(incorporates/superdesIPC-TC-500

superdedbyIPC-RB-276

1/77(.)

A3/81

B11/86

8/.

Reaffirmed9/9110/88(.)

(金属芯电路板性能规范)

1/87(.)

superdedbyIPC-D-275

1/77(.)A3/81

PrintedBoard,Rigid,Single-andDouble-Side,EndProductStandard

IPC-SD-

320B

(

作废

)

PerformanceSpecificationforRigidSingle-andDouble-SidedPrintedBoards

GuidelinesforSelectingPrintedWiringBoardSizes

IPC-D-322UsingStandardPanelSizes(拼板中印制板迭用尺寸指

南)

IPC-MC-

324

PerformanceSpecificationsforMetalCoreBoards

DocumentationRequirementsforPrintedBoards,

1/87(.)

IPC-D-325AsmbliesandSupportDrawings(印制板、组件和支撑

A5/95

件图纸文件要求)

IPC-D-326

InformationRequirementsforManufacturingPrinted

BoardAsmblies(印制板组装制造的文件资料要求)

4/91(.)

12/89(.)

IPC-D-330DesignGuideManual(设计指导手册)

IPC-PD-

335

(

作废

)

ElectronicPackagingHandbook

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IPCDocumentRevisionTable

ComputerNumericalControlFormattingforDrillersandRouters

(钻孔和布线器的计算机控制数据格式)

Page8of18

IPC-NC-

349

8/85(.)

8/72(.)

A2/75B8/77

C10/85ReaffirmedD

7/92TechnicalContent

IdenticaltoIEC-1182-18/85(.)

PrintedBoardDescriptioninDigitalForm

IPC-D-350

(印制板的数字化表述)

PrintedBoardDrawingsinDigitalForm

IPC-D-351

(印制板图形的数字化表述)

IPC-D-352

ElectronicDesignDataDescriptionforPrintedBoardsin

DigitalForm(印制板电子设计数椐的数字化表述)

LibraryFormatDescriptionforPrintedBoardsinDigitalForm

(印制板文件格式的数字化表述)

Printe俄罗斯人口密度 dBoardAsmblyDescriptioninDigitalForm

IPC-D-355

(印制板组件的数字化表述)

BareBoardElectricalTestInformationinDigitalForm

IPC-D-356

(印制裸板电测信息的数字化表述)

IPC-AM-

361

(

作废

)

IPC-MB-

380

SpecificationforRigidSubstratesforAdditiveProcessPrintedBoards

GuidelinesforMoldedInterconnectionDevices

10/90(.)

(模制器件互连指南)

7/74(.)

A2/88

1/90(.)

3/92(.)

A1/98

1/82(.)

1/95(.)8/85(.)

IPC-D-3542/87(.)

IPC-D-390AutomatedDesignGuidelines(自动设计指南)

IPC-C-406

IPC-CI-

408

DesignandApplicationGuidelinesforSurfaceMount

Connectors(表面组装连接器设计和应用指南)

DesignandApplicationGuidelinesfortheUof

SolderlessSurfaceMountConnectors

(非焊接表面组装连接器设计和应用指南)

1/.

IPC-BP-

GeneralSpecificationforRigidPrintedBoardBackplanes

10/80(.)withPress-FitContacts

2011-3-4

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IPCDocumentRevisionTable

421

IPC-D-422

(带压接连接器的刚性印制背板通用技术规范)

DesignGuideforPressFitRigidPrintedBoardBackplanes

(刚性压接印制背板设计指南)

IPC-DW-

424

IPC-DW-

425

IPC-DW-

426

IPC-TR-

460

IPC-TR-

461

GeneralSpecificationforEncapsulatedDiscreteWireInterconnectionBoards

(印制板分立包皮导线互连通用技术规范)

DesignandEndProductRequirementsforDiscrete

WiringBoards(分立线路板设计和成品技术规范)SpecificationsforAsmblyofDiscreteWiring

Page9of18

Reaffirmed4/909/82(.)

1/95(.)

9/82(.)A5/90

12/87(.)

(分立线路组装技术规范)

Trouble-ShootingChecklistforWaveSolderingPrinted

WiringBoards(印制板波峰焊故障检查表)

SolderabilityEvaluationofThickandThinFudCoatings

(厚、薄热涂层的可焊性评估)

1973()

A2/843/79(.)

IPC-TR-

462

IPC-TR-

464

IPC-TR-

465-1

SolderabilityEvaluationofPrintedBoardswithProtective

CoatingsOverLongTermStorage

(具有持效保护涂层的印制板可焊性评估)

AcceleratedAgingforSolderabilityEvaluations

(可焊性的加速老化评估)

RoundRobinTestonSteamAgerTemperatureControlStability

(恒温蒸汽老化的联合测试报告)

10/87(.)

.4/84A12/87

1993

IPC-TR-

465-2

TheEffectofSteamAgingTimeandTemperatureonSolderabilityTestResults

(蒸汔老化时间和温度对可焊性测试结果的影响)

1993

IPC-TR-

465-3

IPC-TR-

466

EvaluationofSteamAgingonAlternativeFinishes,PhaIIA

(对不同处理剂的蒸汽老化评估,PhaIIA)WettingBalanceStandardWeightComparisonTest

7/96

4/95(.)

(润湿平衡标准称重比较测试)

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SupportingDataandNumericalExamplesforANSI/J-

STD-001AppendixD(ANSI/J-STD-001附件D的支持数

据和数字举例)

FactorsAffectingInsulationResistancePerformanceof

PrintedBoards(印制板绝缘电阻的影响因素)

ThermalCharacteristicsofMultilayerInterconnectionBoards

(多层互连板的热特性)

IPC-TR-

474

IPC-TR-

476

IPC-TR-

480

(

作废

)

IPC-TR-

481

IPC-TR-

483

IPC-TR-

484

IPC-TR-

485

IPC-TR-

549

IPC-TR-

551

IPC-DR-

570

IPC-DR-

572

IPC-TR-

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Page10of18

IPC-TR-

467

IPC-TR-

468

IPC-TR-

470

10/96(.)3/79(.)

1/74(.)

AnOverviewofDiscreteWiringTechniques(分立线路综3/79(.)

观)Reprint1984

HowtoAvoidMetallicGrowthProblemsonElectronic

Hardware(如何避免电子硬件的合金化生春来了作文 长)

ResultsofMultilayerTestProgramRoundRobinIV

PhaI

ResultsofMultilayerTestProgramRoundRobinV

4/81(.)

(多层V循环测试程序的结果)

DimensionalStabilityTestingofThinLaminates-Report

4/84(.)

onPhaIInternationalRoundRobinTestProgram

10/87AddendumsRevid3/91

(薄层压板尺寸稳定性测试----)

ResultsofIPCCooperFoilDuctilityRoundRobinStudy

4/86(.)

(IPCCooper箔延展性研究联合报告)

ResultsofCooperFoilRuptureStrengthTestRound

RobinStudy(Cooper箔断裂强度研究联合报告)

MeaslesinPrintedWiringBoards(印制板内的粉点)

QualityAsssmentofPrintedBoardsUdforMounting

andInterconnectingElectronicComponents

(电子元件安装互连印制板的质量评定)

GeneralSpecificationfor1/8InchDiameterShank

CarbideDrillsforPrintedBoards(1/8英寸印制板硬质合

金钻头总技术规范)

1/79(.)

A4/84

3/85(.)

11/73(.)

9/77(.)

A6/849/75(.)

7/93(.)

DrillingGuidelinesforPrintedBoards(印制板钻孔指南)4/88(.)

2011-3-4

IPCDocumentRevisionTable

576

(

已作废

)

IPC-TR-

578

Page11of18

AdditiveProcessEvaluation

LeadingEdgeManufacturingTechnologyReport-ResultingofaRoundRobinStudyonMinimum

ConductorWidthandPlated-ThroughHolesinRigid,

BareCopper,Double-SidedPrintedWiringBoards(前沿

制造技术报告----)

RoundRobinReliabilityEvaluationofSmallDiameter

PlatedThroughHolesinPrintedWiringBoards

(印制板小孔金属化可靠性评估联合报告)

9/77(.)

9/84(.)

IPC-TR-

579

9/88(.)

IPC-TR-

580

IPC-TR-

581

IPC-TR-

582

CleaningandCleanlinessTestProgramPha1TestResults

(清洗和洁净度测试程序第1阶段测试结果)IPCPha3ControlledAtmosphereSolderingStudy

10/89(.)

8/94(.)

IPCPha3可控气氛焊接研究)

IPCPha3No-CleanFluxStudy(IPCPha3免洗助焊

剂研究)

11/94(origpub.)

origpub.'64

A'70

B'74

C'78

D'89

E8/95

F11/99RevisionA:2/99

(印制板质量评定手册)

PrintedBoardQualityEvaluationSlideSet

(印制板质量评定,幻灯片)

8/83(.)

2ndprinting1/86

3rdprinting5/88

A3/90B12/94

Amendment1/96RevisionC:1/00

IPC-A-600AcceptabilityofPrintedBoards(印制板可接收条件)

IPC-QE-

605A

IPC-SS-

605

PrintedBoardQualityEvaluationHandbook

AcceptabilityofElectronicAsmblies

IPC-A-610

(电子组装的可接收条件)

IPC-QE-

615IPC-SS-

AsmblyQualityEvaluationHandbook(组装质量评定手

3/93(.)

册)

AsmblyQualityEvaluationSlideSet(组装质量评定,幻

3/93(.)

2011-3-4

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IPCDocumentRevisionTable

615

IPC-AI-

640

(

已作废

)

IPC描写黄河的诗句 -AI-

641

IPC-AI-

642

IPC-OI-

645

IPC-TM-

650

IPC-ET-

652

灯片)

Ur'sGuidelinesforAutomatedInspectionofUnpopulatedThickFilmHybridSubstrates

Ur'sGuidelinesforAutomatedSolderJointInspection

Page12of18

RevisionA:2/991/87(.)

1/87(.)

(自动焊点检查用户指南)

Ur'sGuidelinesforAutomatedInspectionofArtwork,Interlayers,andUnpopulatedPWB's

(照相底图,内层和PCB裸板自动检查用户指南)StandardforVisualOpticalInspectionAids

10/93(.)

(光学检查目测标准)

TestMethodsManual(测试方法手册)

GuidelinesandRequirementsforElectricalTestingof

UnpopulatedPrintedBoards

(PCB裸板电气测试要求和导则)

Updatedpertestmethod10/88(.)

10/90(.)

IPC-QL-

653

IPC-MI-

660

IPC-R-

700C

被IPC-

7711and

7721

QualificationofFacilitiesthatInspect/TestPrintedBoards,Components,andMaterial

(检查/测试印制板,元件和材料的设备鉴定)IncomingInspectionofRawMaterialsManual

8/88(.)A11/97

2/84(.)

(原材料来料检查手册)

9/67(.)

A12/71

B9/77C1/88

SuggestedGuidelinesforModification,ReworkandRepairofPrintedBoardsandAsmblies

替代

IPC-TA-

720

IPC-TA-

721

IPC-TA-

722

TechnologyAsssmentHandbookonLaminates

(层压板技术评估手册)

TechnologyAsssmentHandbookonMultilayerBoards

(多层板技术评估手册)

TechnologyAsssmentofSoldering(焊接技术评估)

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IPCDocumentRevisionTable

TechnologyAsssmentHandbookonSurfaceMounting

(表面组装技术评估手册)

TechnologyAsssmentSeriesonCleanrooms

(净化间技术评估)

TroubleshootingGuideforPrintedBoardManufacture

andAsmbly(印制板制造及组装故障修理指南)

4/98

Page13of18

IPC-TA-

723

IPC-TA-

724

IPC-PE-

740

1/85(origpub.)

A12/97

9/68(.)

A3/76

B10/80

C1/87D1/96

IPC-CM-

770

IPC-SM-

780

IPC-SM-

782

IPC-EM-

782

IPC-SM-

784

IPC-SM-

785

PrintedBoardComponentMounting(印制板元件安装)

ComponentPackagingandInterconnectingwithEmphasis

3/88(.)

onSurfaceMounting(片式元件SMC的封装和互连)

SurfaceMountDesignandLandPatternStandard

(表面组装设计和焊盘图形标准)

SurfaceMountDesignandLandPatternSpreadsheet

(表面组装设计和焊盘图形电子表格)

GuidelinesforChip-on-BoardTechnology

Implementation

(COB技术应用指南)

GuidelinesforAcceleratedReliabilityTestofSurface

MountSolderAttachments(表面组装焊接可靠性加速试11/92(.)

验指南)

12/90(.)A1/95

3/87(.)

9/89A8/93

Amendment110/96

9/94(.)Addendum12/95

11/90(.)

IPC-SM-786

ProceduresforCharacterizingandHandlingofMoisture/

已被

J-ReflowSensitiveICs

STD-020替

代

IPC-MC-

790

GuidelinesforMultichipModuleTechnologyUtilization

8/92(.)

(多芯片模块技术应用指南)

IPC-S-804

(

已作废

)

SolderabilityTestMethodsforPrintedWiringBoards

被

J-STD-

003

1/82(.)

A1/87

替代

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IPC-S-805

(

已作废

)

SolderabilityTestsforComponentLeadsand

被

J-STD-Terminations

002

替代

IPC-MS-

810

GuidelinesforHighVolumeMicroction(显微切面指

南)

Page14of18

1/85(.)

10/93(.)

IPC-S-815

(

已作废

)

GeneralRequirementsforSolderingElectronic

被

J-STD-Interconnections

001

(已废除,由J-STD-001替代)

替代

IPC-S-816

SMTProcessGuidelineandChecklist(SMT工艺指南和

检查表)

IPC-SM-

817

GeneralRequirementsforDielectricSurfaceMounting

Adhesives(绝缘性表面组装胶粘剂通用规范)

11/77(.)

A6/81B12/87

7/93(.)11/89(.)

IPC-SF-818

(

作废

)

GeneralRequirementforElectronicSolderingFluxes

被

J-STD-

004

(用于电子组件焊接的助焊剂通用技术要求)

2/88(.)

12/91

替代

IPC-SP-819

(

作废

)

被

GeneralRequirementsandTestMethodsforElectronic

J-STD-005GradeSolderPaste

10/88(.)

替代

IPC-AJ-

820

IPC-CA-

821

AsmblyandJoiningManual(组装和连接手册)

GeneralRequirementsforThermallyConductiveAdhesives

(热导胶粘剂通用技术要求)

IPC-CC-

830

QualificationandPerformanceofElectronicInsulating

CompoundforPrintedBoardAsmblies

(印制板组装电绝缘材料的鉴定和性能)PreandPostSolderMaskApplicationCleaning

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1/84(.)

4/90Reaffirmed

A10/988/96(.)

1/95(.)

IPCDocumentRevisionTable

Guidelines

Page15of18

IPC-SM-

839

IPC-SM-

840

4/90(.)

(焊接前,后阻焊膜的清洗指南)

QualificationandPerformanceofPermanentPolymer

Coating(SolderMask成语集锦 )forPrintedBoards

(印制板阻焊膜的鉴定和性能)

11/77(.)

A7/83

B5/88C1/96

10/82(.)

IPC-H-855

HybridMicrocircuitDesignGuide

(

己作废

)

IPC-D-859

DesignStandardforThickFilmMultilayerHybridCircuits

(厚膜多层混合电路设计标准)

IPC-HM-

860

IPC-TF-

870

SpecificationforMultilayerHybridCircuits

12/89(.)

1/87(.)

(多层厚膜电路技术规范)

QualificationandPerformanceofPolymerThickFilm

PrintedBoards(聚合物厚膜印制板的鉴定和性能)

11/89(.)

IPC-D-949

(

作废

)DesignStandardforRigidMultilayerPrintedBoards

被

IPC-D-

275

替代

IPC-ML-

950

(

已作废

)

被

IPC-

RB-276替

代

IPC-ML-

960

IPC-ML-

975

1/87(.)

1/66(.)

A9/70

B12/77C11/86

PerformanceSpecificationforRigidMultilayerPrintedBoards

QualificationandPerformanceSpecificationforMass

LaminatedPanelsforMultilayerPrintedBoards

(多层印制板预制内层敷箔板的鉴定和性能规范)

7/94(.)

被

IPC-D-

325

替代

IPC-ML-990

EndProductDocumentationSpecificationforMultilayerPrintedWiringBoards

9/69(.)

PerformanceSpecificationforFlexibleMultilayerWiring9/72(.)

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IPCDocumentRevisionTable

(

作废

)

IPC-

HybridMicrocircuitDesignGuide(混合微波电路设计指

1402/IPC-

南)

H-855

IPC-1710

OEMStandardforPrintedBoardManufacturers'Qualification

Profile(MQP)(印制板OEM制造商资格鉴定一览表)AsmblyQualificationProfile(AQP)

IPC-1720(印制板组装制造商资格鉴定一览表)

LaminatorQualificationProfile(LQP)

IPC-1730

(层压板制造商资格鉴定一览表)

IPC-2141

ControlledImpedanceCircuitBoardsandHighSpeed

LogicDesign(阻抗调制电路板和高速逻辑电路设计)

1/98

Page16of18

10/82(.)

2/94(.)12/97updated

7/96(.)

4/96(.)2/98(.)

IPC-2221GenericStandardonPrintedBoardDesign

代替IPC-

D-275

(印制板设计通用标准)

SectionalDesignStandardforRigidOrganicPrintedIPC-2222

Boards

代替

IPC-

D-275

(刚性有机印制板设计标准)

SectionalDesignStandardforFlexiblePrintedBoards

IPC-2223

(柔性印制板设计标准)

IPC-3406

GuidelinesforElectricallyConductiveSurfaceMountAdhesives

(表面组装导电胶导则)

IPC-3408

IPC-4101

SpecificationforBaMaterialsforRigidandMultilayer

代替

IPC-

Boards

L-108IPC-L-109

(刚性及多层印制板基材特性规范)

IPC-L-112

IPC-L-115

SpecificationandCharacterizationMethodsfor

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GeneralRequirementsforAnistropicallyConductive

AdhesiveFilms(各向异性导电胶粘剂通用技术要求)

2/98(.)

11/98

7/96(.)

11/96(.)

12/97(.)*

2011-3-4

IPCDocumentRevisionTable

NonwovenCelluloBadPaperforPrintedBoards

IPC-4110

(非织物纤维纸印制板的特性和规格)

IPC-4130

IPC-6011

(印制板通用性能规范)

IPC-6012

IPC-6013

QualificationandPerformanceSpecificationforRigid

PrintedBoards(刚性印制板的鉴定与性能规范)

QualificationandPerformanceSpecificationforFlexible

PrintedBoards(柔性印制板的鉴定与性能规范)

QualificationandPerformanceSpecificationforOrganic

MultichipModule(MCM-L)MountingandInterconnectingStructures

(有机多芯片模块(MCM-L)组装及互连结构的鉴定和性

能规范)

MicrowaveEndProductBoardInspectionandTest

IPC-6018

(微波产品电路板的检查和测试)

PerformaceGuideManualforSingle-andDouble-Sided

IPC/JPCA-

FlexiblePrintedWiringBoards

6202

(单、双面柔性印制电路板性能指导手册)

IPC-7711

ReworkofElectronicAsmblies(电子组件的返修)

2/99

SpecificationandCharacterizationMethodsfor

Nonwoven"E"GlassMat(非织物‘E’玻璃垫规范)GenericPerformanceSpecificationforPrintedBoards

9/98*8/98*

Page17of18

7/96(.)*

7/96(.)

A10/9911/98

IPC-60152/98(.)

1/98(.)

代替

IPC-

R-700C

IPC-7721

4/98(.)

代替

IPC-

R-700C

IPC-9191

RepairandModificationofPrintedBoardsandElectronic

4/98(.)

Asmblies(印制板和电子组件的修理和调整)

代替

IPC-PC-90

IPC-9201

GeneralGuidelineforimplementationofStatistical

ProcessControl(SPC)(SPC实施通则)SurfaceInsulationResistanceHandbook

11/99()

7/96(.)

(表面绝缘电阻手册)

PWBAsmblyProcessSimulationforEvaluationof7/95(.)

ElectronicComponents(电子元件组装工艺仿真的评价)RevisionA:Inprocess

IPC-9501

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AsmblyProcessSimulationforEvaluationofNon-IC

IPC-9504

6/98

Components(非IC器件组装工艺仿真的评价)

PDF文件使用

file://E:RDipc

"pdfFactoryPro"

标准IPC标准（

试用版本创建

new）IPC标准一览表

.htmlPage18of18

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