OA Login
--- Select Language ---
軟板
散熱金屬基板
覆树脂铜箔
太陽能背板
Your prent position is:Products >> PI系列
Halogen Free Black PI -Coverlay Series
Major Feature
1.Excellent thermal resistance and chemical resistance
2.Good electrical performance and insulation performance
3.Good dimensional stability
4.Adhesive flow well controlled and be good for FPC lamination
5.Halogen free, and UL94V-0
List of Specification
黑色PI覆蓋膜ASC-FC系列
Black PI(um)12.5
Ad hesive (um)15~50
姑成语Relea Paper (um)115
Performance Introduction
Test Item Condition
Property
Standard Test method
ASC-
FC015SKT
Peel Strength
Normal（Kgf/cm）90° 1.4≧0.7IPC-TM-650 2.4.9
Chemical Resistance（Drop %）
IPA
Dipping /10min
2.5
≦
20IPC-TM-650 2.3.2
NaOH
1.3
HCL
2.1
叫一声爸妈Adhesive Flow (mm)A0.100.05~0.15IPC-TM-650 2.3.17.1
Shading rate（%）A99.3≧97ASTM D 1003
化风丹
Gloss（gu）60°5040~60ASTM D 523
杨金铭Relea force（gf/5cm）A105~50Allstar Method
Moisture Absorption（%）D-24/23 1.3≦2.0IPC-TM-650 2.6.2
Solder Float Resistance300℃/10c OK300℃/10c IPC-TM-650 2.4.13
Dimensional Stability（%）
MD
Method B
-0.04
±0.15IPC-TM-650 2.2.4
TD0.03
Volume Resistance（Ω-cm）
C-96/35/90
6.4×1015≧1012
IPC-TM-650 2.5.17
退休条件Surface Resistance（Ω） 5.2×1013≧1011
Dielectric Constant （1G HZ）
怎么设置无线路由器C-24/23/50
3.8≦
4.0
IPC-TM-650 2.5.5.3
Dissipation Factor （1G HZ）0.023≦0.04
Note :Testing peel strength、solder Resistance and Resin flow with Coverlay presd on CCL
Storage Condition
Packaging: Below 10℃for three months.
Recommended Press Process and Curing Process
Fitting condition：temp 80℃±120℃, speed 0.5±0.2 m/min
1.Traditional Lamination:
Traditional lamination：
StageⅠ： Temp: heating from 40℃to 160~180℃; Pressure: maintain 10~20Kgf/cm2; Time:30~50min。
StageⅡ：Temp: maintain 160~180℃; Pressure: maintain 25~40Kgf/cm2; Time:40~80min。流量怎么共享
Stage Ⅲ：Temp: cooling down 160~180℃to 40℃; Pressure: maintain 10~20Kgf/cm2; Time:30~60min。
2. Fast Lamination：
会议记录模板范文
Fast Lamination：
StageⅠ：Temp: maintain 170~190℃;
Pressure: maintain 0Kgf/cm2; Time:5~20c。
StageⅡ：Temp: maintain 170~190℃; Pressure: maintain 40～60Kgf/cm2; Time:100～150c。
Curing Process After Fast Lamination：
StageⅠ：Temp: heating from room temperature to 150~170℃;
StageⅡ：Temp: maintain 150~170℃; Time: 60~120min.
[Print] [Clo]
Copyright(C)Allstar Tech.(Zhongshan) Co.,Ltd. All rights rerved. Powered by kenfor－－－Links－－－
