X-23-7762 Thermal Interface Material
证明范文Description of U
Thermal grea (X-23-7762) is a thermal interface material developed by Shin-Etsu
Chemical Co., Ltd. to meet the current and future thermal management requirements of
high performance microprocessors. It is ud to increa heat sink effectiveness by
closing the air gap existing between the top of the processor and the fan heat sink. Air is a
thermal insulator with a thermal conductivity of 0.027W/mK. The grea is applied to the
raid area on top of the processor after the processor is in the socket. The fan heat sink
包村is centered on the processor top, with the raid areas on the bottom of the heat sink and
the processor top aligned. The fan heat sink is firmly presd to evenly distribute the天下没有不散的宴席
百依百顺thermal grea until the metal of the heat sink is felt against the metal of the processor top.
The excess grea can be removed by wiping with a soft cloth.
Typical Properties
Appearance Gray Viscosity at 25℃(Pa-s) 180英语二真题
Specific gravity at 25℃ 2.55 Volatile Content after 24hrs. at 150℃(%) 2.58
Thermal Conductivity (W/m-℃) More than 4.0W/m℃(with solvent)
刘镇华More than 6.0W/m℃(w/o solvent as X-23-7732)
Handling instruction
1. Once open the lid, plea u it up as soon as possible.
2. Require stirring the material up before using.
3. X-23-7762 contains 2wt% of solvent as a diluted component for application of screen-printing. Therefore, require removing solvent after putting 7762 on substrate.
梦见跟人打架
Recommendable heating condition: 60 deg C x 30min or Room Temperature X 8 hours.汉陵
