DRAFT
AEC - Q004
August 31, 2006
Automotive Electronics Council
Component Technical Committee
Component Technical Committee
Acknowledgment
Any document involving a complex technology brings together experience and skills from many sources. The Automotive Electronics Council would especially like to recognize the following significant contributors to the revision of this document:
Sustaining Members:
Mark A. Kelly Delphi Corporation
Jean Clarac Siemens VDO
Brian Jendro Siemens VDO
Robert V. Knoell Visteon Corporation
Associate Members: Guest Members:
Tim Haifley Altera David Locker AMRDEC
Daniel Vanderstraeten AMI Semiconductor Jeff Jarvis AMRDEC
屁滚尿流Earl Fischer Autoliv
玛格烈菊
Mike Klucher Cirrus Logic
Xin Miao Zhao Cirrus Logic
John Timms Continental Automotive Systems
Roy Ozark Continental Automotive Systems
Nick Lycoudes Freescale
Werner Kanert Infineon Technologies
Elfriede Geyer Infineon Technologies
青鸟读后感
John Bertaux International Rectifier
Gary Fisher Johnson Controls
Tom Lawler Lattice Semiconductor
Mike Buzinski Microchip
Rob Horton Microchip
Annette Nettles NEC Electronics
Raj Radjassamy NEC Electronics
Zhongning Liang NXP Semiconductors
Mark Gabrielle ON Semiconductor
Ken Berry Renesas Technology
Bruce Townnd Spansion
Adam Fogle Spansion
Brian Mielewski STMicroelectronics
James Williams Texas Instruments
Diana Siddall Texas Instruments
Don Pecko Xilinx
Other Contributors:
Masachi Mura NEC Electronics
Michael Wieberneit NEC Electronics
David Lehtonen Spansion
Component Technical Committee
NOTICE
AEC documents contain material that has been prepared, reviewed, and approved through the AEC Technical Committee.
AEC documents are designed to rve the automotive electronics industry through eliminating misunderstandings between manufacturers and purchars, facilitating interchangeability and improvement of products, and assisting the purchar in lecting and obtaining with minimum delay the proper product for u by tho other than AEC members, whether the standard is to be ud either domestically or internationally.
AEC documents are adopted without regard to whether or not their adoption may involve patents or articles, materials, or process. By such action AEC does not assume any liability to any patent owner, nor does it assume any obligation whatever to parties adopting the AEC documents. The information included in AEC documents reprents a sound approach to product specification and application, principally from the automotive electronics system manufacturer viewpoint. No claims to be in Conformance with this document shall be made unless all requirements stated in the document are met.
Inquiries, comments, and suggestions relative to the content of this AEC document should be addresd to the AEC Technical Committee on the link
Published by the Automotive Electronics Council.
This document may be downloaded free of charge, however AEC retains the copyright on this material. By downloading this file, the individual agrees not to charge for or rell the resulting material.
Printed in the U.S.A.
上滑音
All rights rerved
Copyright © 2006 by Delphi, Siemens VDO, and Visteon Corporation. This document may be freely reprinted with this copyright notice. This document cannot be changed without approval from the AEC Component Technical Committee.
Component Technical Committee
ZERO DEFECTS GUIDELINE
丧事用词大全The propod DRAFT of AEC-Q004 is made available for a 6-month industry review period, scheduled to expire on April 1, 2007. All comments and suggested edits should be made by contacti
ng the AEC Technical Committee (/AECRequest.html). After the 6-month review period has expired, all received comments and suggestions will be reviewed by the Technical Committee and incorporated (where applicable) into a final version of the Q004 document.
1. SCOPE深航
This document describes and organizes a t of tools and process which suppliers and urs of integrated circuits can u to approach or achieve the goal of zero defects during a product's lifetime.
This guideline makes suggestions for when each of the tools and methods should be ud depending on the application or business ca.
This is not to be construed as a requirements document, but is a tool box of methods that have been ud to reduce defects. This is not an exhaustive list. There are suppliers that are using internally developed and proprietary methods to reduce defects. As the part and/or process is optimized and matures over time, less tools are needed to improve or maintain quality and reliability.育儿知识小班
1.1 Purpo
lendThe flowchart below describes the quence of steps involved in component design, manufacture, test and u and where each of the zero defect tool or method fits in with this component flow. Each tool or method is described along with how it address zero defects, when it would or wouldn't be ud, the estimated cost versus benefit, the components and technologies it applies to, the defect type addresd and the metric ud to measure performance.
Component Technical Committee
