怎么种头发
ELECTRICAL CHARACTERISTICS
Maximum
Time To Trip Resistance
Agency
Approval Part Number I hold
(A)
I trip
(A)
V max
(Vdc)
I max
(A)
P d max.
(W)
Current
(A)
Time
裂点
(Sec.)一报告两评议指什么
R min
(Ω)
R 1max
(Ω) UL/CSA TÜV SMD2016P030TF 0.30 0.60 60 20 1.40 1.50 3.000.500 2.300 33 SMD2016P050TF 0.55 1.10 60 20 1.40 2.50 5.000.200 1.000 33 SMD2016P100TF 1.10 2.20 15 40 1.408.00 0.500.100 0.400 33 SMD2016P100TF/33 1.10 2.20 33 40 1.408.00 0.500.100 0.400 33 SMD2016P150TF 1.50 3.00 15 40 1.408.00 1.000.070 0.180 33 SMD2016P200TF 2.00 4.20 6 40 1.408.00 3.000.048 0.100 33
Note:I
hold
= Hold current: maximum current device will pass without tripping in 20℃ still air.
I trip =Trip current: minimum current at which the device will trip in 20℃ still air.
V max = Maximum voltage device can withstand without damage at rated current (I max)
I max = Maximum fault current device can withstand without damage at rated voltage (V max)
P d = Power dissipated from device when in the tripped state at 20℃ still air.
R min= Minimum resistance of device in initial (un-soldered) state.
小猫咪简笔画
R 1max= Maximum resistance of device at 20℃measured one hour after tripping or reflow soldering of 260℃for 20 c.
*Value specified were determined using the PWB with 0.090”*1.5oz copper traces.
Caution: Operation beyond the specified rating may result in damage and possible arcing and flame.
◎Specifications are subject to change without notice.
z The SMD2016 Halogen and Lead(Pb) Free Series, a polymer-bad Positive Temperature Coefficient (PTC) device to protect electrical circuits against overcurrent conditions with rettable feature, is fully compatible with current industrial standards.
z The new designed SMD2016 Halogen and Lead(Pb) Free Series provides surface mount overcurrent protection with superior performance that is compliant with RoHS Directive 2002/95/EC.
z Application: The SMD2016 Halogen and Lead(Pb) Free Series is ideal for computers and peripherals and can be applied to almost anywhere there is a low voltage power supply and a load to be protected.
z The solder plated termination is designed to meet or exceed solderability specifications and provide excellent solder joint inspectability.
z Agency Approval: UL/CSA File No.E201431
TÜV Certificate # R50099121
z
How to Select a Polymer PTC fu
(1)Determine the following operating parameters for the circuits:
(A)Normal Operating Current (I hold)
(B)Maximum Circuit V oltage (V max)
(C)Maximum Interrupt Current (I max)
春天时间
(D)Normal Operating Temperature (min℃/max℃)
(2)Select the device form factor and dimension suitable for the application:
Surface Mount Device (SMD Series)
Radial Leaded Device (RLD Series)
Axial Leaded Strap Device (STD Series)
Other Custom-designed Device (Disc/Chip)
(3)Compare the maximum ratings for V max and I max of the PTC device with
the circuit in application and make sure that the circuit’s requirement does not exceed the device ratings.
(4)Check that the PTC device’s trip time (time-to-trip) will protect the circuit.
(5)Verify that the circuit operating temperatures are within the PTC device’s
normal operating temperature range.
(6)Verify the performance and suitability of the chon PTC device in the
application.
THERMAL DERATING CURVE FOR SMD2016 SERIES
THERMAL DERATING CHART FOR SMD2016 SERIES – Ihold (Amps)
RECOMMENDED DATA
Ambient Operation Temperature
Model
-40℃ -20℃0℃ 23℃40℃50℃60℃ 70℃ 85℃SMD2016P030TF 0.45 0.40 0.35 0.30 0.25 0.23 0.20 0.18 0.14 SMD2016P050TF 0.93 0.80 0.65 0.50 0.38 0.32 0.25 0.19 0.09 SMD2016P100TF 1.66 1.47 1.29 1.10 0.91 0.83 0.73 0.64 0.50 SMD2016P100TF/33 1.66 1.47 1.29 1.10 0.91 0.83 0.73 0.64 0.50 SMD2016P150TF 2.26 2.00 1.76 1.50 1.24 1.13 1.00 0.87 0.68 SMD2016P200TF 2.80 2.50 2.19 2.00 1.84 1.74 1.50 1.34 1.14 -40.000.0040.0080.00120.00
Device's Ambient Temperature ()
℃
0.00
50.00
100.00
150.00
200.00
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A
B
B
A
A－SMD2016P050TF
SMD2016P100TF
SMD2016P200TF
B－SMD2016P030TF
SMD2016P100TF/33
SMD2016P150TF
A VERAGE TIME-CURRENT CURVE FOR SMD2016 SERIES
0.10 1.0010.00
Fault Current (Amp.)
0.01
0.10
1.00
10.00
100.00
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宝宝要睡觉)
A
B
扇枕温衾的故事C
D
E
F
A－SMD2016P030TF
B－SMD2016P050TF
C－SMD2016P100TF金甲圣衣
D－SMD2016P100TF/33
E－SMD2016P150TF
F－SMD2016P200TF
SOLDER REFLOW
RECOMMENDED CONDITIONS
Profile Feature Pb-Free Asmbly
Average Ramp-Up Rate (Ts max to Tp) 3℃/cond max.
Preheat
-Temperature Min (Ts min)
-Temperature Max (Ts max)
-Time (Ts min to Ts max)
150℃
200℃
60-180 conds
Time maintained above:
-
Temperature (T L)
-Time (t L)
217℃
60-150 conds
Peak Temperature (Tp) 260℃
Time within 5℃of actual Peak
Temperature (tp) 20-40 conds
Ramp-Down Rate 6℃/cond max.
Time 25℃ to Peak Temperature 8 minutes max.
Storage Condition 0℃~35℃, ≦70%RH
Note 1: All temperature refer to topside of the package, measured on the package body surface.
Note 2: If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements.
z Recommended reflow methods: IR, vapor pha oven, hot air oven, N2 environment for lead-free z Recommended maximum paste thickness is 0.25mm (0.010 inch)
z Devices can be cleaned using standard industry methods and solvents.
