英文简称 | 英文全稱 | 中文名稱 | |
0 Acc/1 Rej | 0 defect is Accepted and 1 or more defect is Rejected | 0收1退 | |
2/O | 2ed optical inspection | 二光目视 | |
4-state | 4 states of threshold in MLC. Can store 2 bits of information (00,01,10,11) | Cell的4个状态 | |
5M1E | Man machine Material Method Measure Environment | 人机物法环 | |
5W1H | When where who what why how | 5W1H | |
70nm | 70 nanometer min. feature size. 0.07 micrometer | 70纳米 | |
8D report | 8 Discipline report | 8D 报告*全球通用CAR格式* | |
ABL | All bit line memory architecture | ABL | |
Adir | USB controller | Adir | |
ADM | General Administration Division | 行政管理处 | |
AMS | Accessory Management System | 配件管理系统 | |
AND | Reference to design architecture and cell (Hitachi-type cell) | AND | |
ASE | ASE device asmbly hou, Kaohsuing, Taiwan | ASE Taiwan | |
ASY | Asmbly Operation | 封装部 | |
ASL | Approved supplier list | 合格供应商清单 | |
ATA | Advanced technology Attachment. Protocol for PC cards | ATA, 扩展型 | |
Athens | ARC bad controller for CF and 3B with NAND 1.3 micron memory | Athens | |
AQL | Acceptance Quality Level | 可接收品质水准 | |
AMS | Accessory Management Section | 配件管理 | |
AP | Account Payable | 应付账款 | |
AR | Account Receivable | 应收账款 | |
ACC | Accountant Department | 财务部 | |
ABM | 狗牙雨Activity-Ba Management | 作业成本管理 | |
ABB | Activity-Bad Budgeting | 实施作业预算制度 | |
ABC | Activity-Bad Costing | 作业成本制度 | |
APS | Advanced Planning and Scheduling | 先進規畫與排程系統 | |
APQP | Advanced Production Quality Planning | 产品质量先期计划 | |
AHU | Air Handle Unit | 空调箱 | |
AWB | Airway Bill | 航运收据 | |
ALP | 永贞革新 Algorithmic Pattern Generator | 演算模式發生器 | |
ASP | Application Service Provider | 應用程式服務供應商 | |
AVL | Approved Vendor List | 认可的供应商名单 | |
ASY-WIP | Asmbly-Work In Process | 組裝物流系統 | |
AVR | Automatic Voltage Regulator | 稳压电源 | |
ATP | Available To Promi | 可承諾量 | |
AOQ | Average Outgoing Quality | 平均出货质量 | |
BG | Back Grinding | 背面研磨 | |
BGA | Ball grid array | 球栅阵列封装 | |
BIB | Burn-in Board | 老化测试板 | |
Blade | Dicing Blade | 切割刀 | |
Bluetooth | Short range wireless local area network standard | 蓝牙 | |
BPO | Bond pad opening | 焊盘尺寸 | |
BPP | Bond pad pitch | 焊盘间距 | |
BST | Ball shear test | 焊球推力测试 | |
Bad Die | Bad Die | 不良芯片 | |
Bake | Bake | 烘烤 | |
Bake Oven | Bake Oven | 烤箱 | |
BOM | Bill Of Material | 物料清单 | |
BTF | Build To Forecast | 计划式生产 | |
BTO | Build To Order | 订单式生产 | |
BI | Burn-in | 老化测试 | |
BIB | Burn-in Board | 老化测试板 | |
BTS | Burn-in board Test station | 老化测试站 | |
BI OVEN | Burn-in Oven | 老化测试炉 | |
BPR | Business Process Reengineering | 业务流程在设计 | |
BP | Bussiness Planning Section | 业务计划科 | |
Bump | gold Bump, solder Bump | 凸块 | |
Ball size | 焊球直径 | ||
Ball/wire neck | 引线线颈 | ||
Blue tape | 蓝膜 | ||
Bonding diagram | 焊线图 | ||
Bowing up | 上翘 | ||
Bristle Brush | 清模刷 | ||
Bubble | 起泡 | ||
Buy-off | 验收 | ||
Bond power | 焊接超声功率 | ||
CAL | Calibration | 校准 | |
CAPA | Corrective and preventive action | 纠正与预防措施 | |
Castte | Wafer Castte, metal Castte | 晶圆盒 | |
C&B | Compensation & Benefit | 员工福利 | |
CCB | Change control board | 更改控制委员会 | |
CDG | Celestica Dongguan, China | Celestica 公司 | |
CF | Compact Flash | CF | |
CGST | Charge gain stress test | CGST | |
Chipping | Surface, bottom, side, Chipping | 碎裂 | |
Chop | Term applied to a memory that has been “cut” down from a higher capacity | 降级 | |
CMC | Calibration Management Center | 校仪中心 | |
COB | Chip on board asmbly | COB | |
CRD | Configuration requirements document | 配置文件 | |
Cruzer | SanDisk USB Drive. Cruzer mini, Cruzer micro, Cruzer titanium | Cruzer | |
CMC | Calibration Management Center | 仪校科 | |
CAL-CUB | Calibration-Clock Utility Board | 校准时钟效用板 | |
CAL-DIB | Calibration-Device Interface Board | 校准设备介面板 | |
CRP | Capacity Requirements Planning | 产能需求规划 | |
CE | Center Engineering Department | 中心技术部 | |
CLCC | Ceramic Leadless Chip Carrier | 陶瓷引線晶片承載系統 | |
Channel | Channel | 通道 | |
COF | Chip On Film | 軟膠覆晶 | |
COG | Chip On Glass | 玻璃覆晶 | |
CSP | Chip Scale Package | 芯片级封装 | |
Chip tray | Chip tray | 晶粒盘 | |
CP-WIP | Circuit Probing-Work In Process | CP物流系統 | |
Clean Room | Clean Room | 无尘室 | |
CDA | Compress Dry Air | 压缩空气 | |
CAD | Computer Aided Design | 计算机辅助设计 | |
CIM | Computer Integration Manufacture Department | 工程资讯部 | |
CTO | Converter Test Option | 轉動測試選紐 | |
CT | Cooling Tower | 冷却塔 | |
CAR | Corrective Action Report | 校正措施報告 | |
CORR. | Correlation | 验证 | |
Corrosion | Corrosion | 腐蚀 | |
CM | Cost Management | 成本控制 | |
CM | Contract manufacture | 合同制造商 | |
Counting | Counting | 盘点 | |
CPIS | CP Information System | CP资讯系统 | |
Crack | Crack | 破裂 | |
Criteria | Criteria | 标准 | |
CPM | Critical Path Method | 要经法 | |
Cross L. | Cross line | 十字路 | |
CFO | Customer Focud Organization | 客户导向组织 | |
COP | Customer Oriented Process | 顾客导向流程 | |
CS | Customer Service Department | 客服部 | |
C/T | Cycle Time | 周期 | |
Cull box | 废料箱 | ||
Dam | Damage | 受损 | |
D.R. | Data Retention | 數據保持力 | |
DT | Data Transform | 资料转换 | |
Date Code | 管弦乐Date Code | 週期碼 | |
DPU | DC Test & Programmable Power Supply | 直流測試與可程式電源供應 | |
DSS | Decision Support System | 决策支持系统 | |
Dept. | Department | 部，部门 | |
DFMEA | Design FMEA | 设计实效模式与效应分析 | |
DMT | Design Maturing Testing | 成熟度验证 | |
DPPM | Defective parts per million | 每百万零件的次品数 | |
DA | Die Attach | 贴片：贴片工艺 | |
Dam | Damage | 损伤 | |
DTSOP | TSOP containing 2 memory die | DTSOP | |
DC_era | Charge gain or loss from cell due to voltage fields | DC_era | |
DST | Die shear strength | 芯片推力测试 | |
DPPO | Defective parts per opportunity | 产品的缺陷数 | |
DO | Day orders | 当天有效订单 | |
DOE | Design of Experiments | 实验设计 | |
DRO | Design Responsible Organization | 具有設計职責的組織 | |
DVT | Design Verification Testing | 设计验证 | |
DM | De-taping Mount | 撕贴片 | |
Device | Device | 型号， 元件 | |
DPS | Device Power Supply | 设备供应电源 | |
Device Type | Device Type | 產品型號 | |
Dut | Device under test | 測試物 | |
Blade | dicing Blade | 切割刀 | |
Dicing | Dicing saw | 切割 | |
Die | Die | 晶粒 | |
Diff | Difference | 差异 | |
DL | Direct Labor | 直接人员 | |
DLT | Dynamic Life Testing | 动态寿命测试 | |
DW | Wafer saw | 芯片切割 | |
Device Package Types | 其间封装类型 | ||
DI Wafer | 去离子水 | ||
Die tilt | 芯片倾斜度 | ||
Dry Box | 干燥箱 | ||
Disc | Disc | 磁碟 | |
Dispo/handle | Dispo/handle | 处置 | |
DRP | Distribution Resource Planning | 運銷資源計劃 | |
Div. | Division | 處 | |
ECR/N | Document & Engineering Change Request/Notice | 文件及工程變更申請/通知 | |
DCC | Document Control Center | 文管中心課 | |
DDR SDRAM | Double Data Rate SDRAM | 雙倍數據速率同步動態記憶體 | |
Down | Down | 当机 | |
Download | Download | 下载 | |
DBR | Drum-Buffer-Rope | 限制驅導式排程法 | |
DCP | Dry Coil Pump | 干盘泵 | |
DIMM | Dual In-line Memory Module | 雙列直插式存儲模組 | |
Dummy Wafer | Dummy Wafer | 報廢的晶片 | |
EFF | efficiency | 效率 | |
ECN | Engineering change notice | 工程变动通知 | |
ECO | Engineering change order (same as ECN) 赞的近义词 | 工程变更单 | |
ECR/N | Engineering Change Request/Notice | 工程变更申请或通知 | |
ERD | Engineering respon document | 工程响应文件 | |
ER | Employee Relationship | 员工关系 | |
ERS | Electric Quality Control | 电性测试 | |
EMC | Electric Magnetic Capability | 電磁相容 | |
EQC | Electric Quality Control | 電性抽測 | |
EDI | Electronic Data Interchange | 電子資料交換 | |
EFA | Electronic Failure Analysis | 電性失效分析 | |
E-FAB | Electronic-Fabrication | 電子化工廠資訊系統 | |
ESD | Electro-Static Discharge | 靜電放電 | |
ECRS | Eliminate Combine Rearrange Simplify | 取消,合併,重組,簡化 | |
Ending lot | Ending lot | 結批 | |
EAMS | Engine & Accessory Management System | 機台及零件管理系統 | |
ENG | Engineering | 工程 | |
ES | Engineering Support | 工程支援 | |
ERP | Enterpri Resource Planning | 企業資源計劃 | |
EMS | Environment Management System | 環境管理系統 | |
ET | Expansile Tank | 膨胀水箱 | |
Ejector Pin | 顶针 | ||
Epoxy | 环氧树脂 | ||
EDO RAM | Extended Data Out RAM | 扩展资料输出記憶體 | |
F/C | Flip Chip | 覆晶 | |
FA | Failure Analysis | 失效分析 | |
FAC | Facility Department | 廠務部 | |
FCT | Functional test. Performed immediately after SMT asmbly (sample only) | 功能测试 | |
FCT2 | Functional test on the PCBA at one time | FCT2 | |
Flash drive | 2.5 inch or 3.5 inch disk drive form factor solid state memory drive | Flash drive | |
FLEX | Flextronics, Xixiang, China | 伟创立公司 | |
FM | Foreign Material | 外来物 | |
FMEA | Failure Mode and Effect Analysis | 失效模式和效应分析 | |
FOV | Final Outgoing Visual Inspection | 出货外观检查 | |
FCU | Fan Coil Unit | 风机盘管 | |
FRD | Financial respon document | 财务反应文件 | |
FW | Firmware | 韧键 | |
Finger cots | 指套 | ||
Flick Test | 脱球测试 | ||
FFU | Fan Filter Unit | 风扇过滤单元 | |
FPM RAM | Fast Page Mode RAM | 快速頁面模式記憶體 | |
FQC | Final Quality Control | 最終(成品)品質管制 | |
FT-CIM | Final Test Computer Integration Manufacture | FT計算機整合製造 | |
FT-WIP | Final Test-Work In Process | FT物流系統 | |
FIN | Financial Department | 財務部 | |
FD | Financial Division | 財務處 | |
FBGA | Fine-Pitch Ball Grid Array | 精細球柵陣列 | |
FGI | Finished Goods Inventory | 成品倉 | |
FIFO | First In First Out | 先進先出 | |
Fa | Fix Asts | 固定資產 | |
Flow | Flow | 站別 | |
Tape | Foil tape | 膠膜 | |
FCST | Forecast | 預估 | |
Foundry | Foundry | 晶圓代工廠 | |
FOB | Free On Board | 離岸價格 | |
Fu | Fu | 保險絲 | |
GR&R | Gage Repeatability & Reproductivity | 量測器具的重複性與再現性 | |
GC | (Generic) Card test inventory | Generic测试卡库存 | |
GIP | Geographically integrated partner | ||
Grounded | Grounded | 接地 | |
GL | General Ledger | 總帳 | |
Bump | gold Bump, solder Bump | 凸塊 | |
Good Die | Good Die | 良數 | |
Grinding | Grinding | 研磨 | |
Grinding wheel | Grinding wheel | 磨石 | |
Gross Die | Gross Die | 總測試數 | |
GDPW | Gross Die Per Wafer | 每片晶圓測試Die總數 | |
GT | group technology | 群組技術 | |
GUA | Guard Section | 保安課 | |
Handler | Handler | 分類機 | |
HAST | Highly Accelerated Stress Test | 加速温湿度压力测试 | |
Hermon | ARC bad controller for rial products | Hermon | |
Hermon rev_F | Latest revision of Hermon controller | Hermon rev_F | |
Hermon UMC | UMC fabricated Hermon. Latest revision is rev_B | Hermon UMC | |
Hermon 1X | Reduced size Hermon controller. Pads on two sides only | Hermon 1X | |
HTST | High Temperature Storage Test | 高温存贮测试 | |
HD | Handling Cost | 搬運成本 | |
H/W | Hardware | 硬件 | |
H-Bar | H-Bar | H型柵 | |
HE | Heat Exchanger | 热交换器 | |
HEPA | High Efficiency Particulate Air filter | 高效微粒空气过滤器 | |
Hold Lot | Hold Lot | 停止測試批 | |
HV | Hou Vacuum | 大葱烧海参的做法中央集尘 | |
HR | Human Resource Department | 人力資源部 | |
HRD | Human Resource Development | 人力资源开发 | |
HRP | Human Resource Planning | 人力资源计划 | |
HRM | Human Resources Management | 人力资源管理 | |
Idle | Idle | 待料 | |
IDD | Supply current | 补充电流 | |
IDE cards | Collective name for all flash drives using IDE protocol (similar to ATA) | IDE cards | |
IMC | Intermetallic | 金属间化合物 | |
ITD | Information Technology Department | 资讯技术部 | |
I&E | Import & export Section | 關務課 | |
IQC | Incoming Quality Control | 進料品質管制 | |
IND L. | Index line | 索引線 | |
IDL | Indirect Labor | 间接人员 | |
IE | Industrial Engineering Section | 工業工程課 | |
II | Information Integrate System | 資訊整合系統 | |
IT | Information Technology Division | 資訊技術處 | |
ISAR | Initial Sample Approval Request | 首批樣品認可 | |
INK | INK | 墨點 | |
INK Shift | INK Shift | 拖墨 | |
IPQC | In-Process Quality Control | 製程中品質管制 | |
IC | Integrated Circuit | 積體電路 | |
IM | Integrated Manufacturing | 集成制造 | |
ICAR | Internal Corrective Action Request/Report | 內部矯正措施要求/報告 | |
IATF | International Automotive Task Force | 國際汽車推動小組 | |
IEC | International Electrotechnical Commission | 國際電工技術委員會 | |
ISO | International Organization For Standardization | 國際標準化組織 | |
IOP | Involvement of People | 全員參與 | |
Inspection jig | 抽检夹具 | ||
JEDEC | |||
JIT | Just In Time | 准时化生产 | |
Kerf | Kerf | 刀痕 | |
Keyboard | Keyboard | 鍵盤 | |
Kit | Kit | 測試軌道 | |
KM | Knowledge Management | 知識管理 | |
Label | Label | 標籤 | |
LSR | Lar Repair | 雷射修補 | |
L/S | Lead scanner | 掃腳 | |
LGA | Land grid array (ball grid array with pads instead of balls) | 栅格镇裂封装 | |
Leader | Leader | 領班 | |
LTO | lead-time offt | 前置時間逆推 | |
LP林黛玉台词 | Lean Production | 精益生产 | |
LTC | Least Total Cost | 最小總成本法 | |
LUC | Least Unit Cost | 最小單位成本 | |
L/C | Letter Of Credit | 信用證 | |
LD | Loader | 上料區/上板機 | |
Loader/unloader | Loader/unloader | 上板/下板 | |
LOG | Logistics Department | 運籌部 | |
Loss | Loss | 遺失 | |
LRR | Lot reject rate | 批退率 | |
Lifetime | 寿命 | ||
Lifted bond | 焊球脱落 | ||
Loop height | 弧高 | ||
MB | Main Board | 主板 | |
M/C | Machine | 机器 | |
MCO | Manufacturing change order | 生产变更单 | |
MCP | Multi chip package | 多芯片封装 | |
MDDS | Material Declaration Data Sheet | 物料申报清单 | |
Meg/M | Megabit (1Megabit=1024K) | 兆 | |
MiniSD | MiniSD | ||
MKB | Media Key Blocks | MKB | |
MLC | Multi level cell (more than two states of logic per memory cell) | MLC | |
MAU | Make up Air Unit | 新风空调箱 | |
4M1E | Man Machine Material Method Environment | ||
M/M Ratio | Man VS Machine Ratio | 人机比 | |
MCC | Management Control Center | 管理中心 | |
MIS | Management Information System Section | 資訊服務課 | |
MOP | Management of Process | 管理過程 | |
Manual test | Manual test | 點測 | |
MFG1 | Manufacturing Division 1 | 製造一處 | |
MFG2 | Manufacturing Division 2 | 製造二處 | |
MFG3 | Manufacturing Division 3 | 製造三處 | |
MES | Manufacturing Exection System Section | 資訊自動化課 | |
MRP | Manufacturing Resource Plan | 制造资源规划 | |
MRP | Materials requirement planning | 无聊需求策划 | |
MS | Memory stick 2.0 | 存储棒 | |
MS 1.4 | Memory stick. Different compatibility from MS 2.0 | MS 1.4 | |
MS Pro | Memory stick Pro. Brand name ud by Sony | MS Pro | |
MS Pro Duo | Reduced form factor version of the MS Pro | MS Pro Duo | |
Mark | Mark | IC正印 | |
Marking Die | Marking Die | 不完整區域 | |
Mass Production | Mass Production | 量產 | |
MPS | Master Production Schedule | 主生產排程 | |
MCCS | Material Cycle Count Sheet | 物料循環盤點表 | |
MIT | Material Issue Ticket | 領料單 | |
MM | Material Management | 物管 | |
MMC | Multi Media card | MMC | |
MRB | Material review board | 物料评审委员会 | |
MRD | Marketing requirements document | 市场需求文件 | |
MSDS | Material Safety Data Sheet | 物料安全数据表 | |
MSL | Moisture Sensitivity Level | 湿气灵敏度等级 | |
MTI | Memory test inventory | Memory 测试库存 | |
MAG | 弹夹 | ||
Marker pen | 记号笔 | ||
Misalign | 移位 | ||
Mismatch | 错位 | ||
Missing wire | 缺线 | ||
Mold gate | 浇铸口 | ||
Molding | 塑膜成型 | ||
MRT | Material Return Ticket | 退料單 | |
MSA | Measurement System Analysis | 量測系統分析 | |
MTO | Memory Test Option | 記憶體測試選紐 | |
MFG1 PD1 | MFG 1 Production Department 1 | 生產一部 | |
MFG1 PD2 | MFG 1 Production Department 2 | 生產二部 | |
MFG2 ES1 | MFG 2 Engineering Support Department 1 | 工程支援一部 | |
MFG2 ES2 | MFG 2 Engineering Support Department 2 | 工程支援二部 | |
MFG2 ES3 | MFG 2 Engineering Support Department 3 | 工程支援三部 | |
MFG2 ES4 | MFG 2 Engineering Support Department 4 | 工程支援四部 | |
MFG3 ES | MFG 3 Engineering Support Department | 三處工程部 | |
MFG3 PE | MFG 3 Process Engineering Department | 三處製程部 | |
MFG3 PD | MFG 3 Production Department | 三處生產部 | |
Microscope | Microscope | 顯微鏡 | |
Scope | Microscope/ Oscilloscope | 顯微鏡/示波器 | |
MBSR | Mutual Beneficial Supplier Relationship | 與供應商共榮共利 | |
NS | Network Service Section | 網絡服務課 | |
NPI | New Product Introduction | 新產品導入 | |
NA | No Available | 無效的 | |
NAND | Not-AND Reference to design architecture and cell (Toshiba-type cell) | NAND | |
NCF | New configuration form | ||
NOR | Not-OR. Reference to design architecture and cell (SanDisk&Intel-type cell) | NOR | |
NCR | Non-Conformity Report | 不符合事項報告 | |
NDA | Non-Disclosure Agreement | 保密合約書 | |
Normal test | Normal test | 第一次測試 | |
Offt | Offt | 偏差 | |
OLAP | On-Line Analytical Processing | 線上分析處理 | |
OJT | On-the-Job Training | 在职培训 | |
O/S | Open/Short | 短路/開路 | |
OI | Operation instruction | 作業指導書 | |
OR | Operation Rearch | 运筹学 | |
OP | Operator | 作業員 | |
OPT | Optimized Production Technology | 最佳生產技術 | |
OF | Oriental Flat | 6” 平邊 | |
Offt | Offt | 偏差 | |
OPTH | Operating Temperature and Humidity | 运行状态下的温室度测试 | |
ORT | On going Reliability Testing | 可靠性测试 | |
ODM | Original Design & Manufacture | 委託設計與製造 | |
OEM | Original Equipment Manufacture | 委託代工 | |
OOC | Out Of Contol | 超出管制 | |
OCAP | Out of Control Action Plan | 失控反應計劃 | |
OOS | Out Of Specification | 超出規格 | |
OQC | Outgoing Quality Control | 出貨品質管制 | |
Output | Output | 產出 | |
Optional | 可选的 | ||
Orientation | 方向，定位 | ||
Outline criteria | 外观标准 | ||
OD | Over Driver | 針壓 | |
O/U | Over Kill | 誤宰 | |
O/U kill | Over/under kill | 誤宰/誤放 | |
P/k Type | Package Type | 包裝型态 | |
P/K | packing | 包裝 | |
PL | Packing List | 裝箱單 | |
Pad | Pad | 焊墊 | |
Pass | Pass | 通過 | |
Pass/fail | Pass/fail | 良品/不良品 | |
PGU | Pattern Generator Unit | 模式发生器单元 | |
PCMCIA | Personal Computer Memory Card International Association | 个人电脑存储卡估计委员会 | |
PCN | Process Change Notification | 工程变更通知单 | |
PCT | Pressure Cooker Test | 压力饱和湿度测试 | |
PDF | Product definition form | 产品定义模板 | |
Plato | Controller for memory stick 1.4 | Plato | |
PMC | Post Molding Cure | 塑封后烘烤 | |
PPM | Parts per million | 百万分之一 | |
Precon | precondition | 预处理 | |
PCI | Personal Computer Interface Board | 电脑介面板 | |
P&P | Pick & Place | 挑揀 | |
PMU | Pin Measure Unit | 針測單元 | |
PDCA | Plan-Do-Check-Action | PDCA | |
PBGA | Plastic Ball Grid Array | PBGA ，塑料球柵阵列 | |
PLCC | Plastic Leadless Chip Carrier | 塑料式引线芯片封裝 | |
PNP | Plug & Play | 热插拔式 | |
FMEA | Potential Failure Mode and Effect Analysis | 潜在失效模式及效应分析 | |
PWR | Power | 电源 | |
PM | Preventive Maintenance | 维修保养 | |
P/C | Probe Card | 针测板 | |
Probe mark | Probe mark | 针痕 | |
Prober | Prober | 针测机 | |
PA | Process Approach | 流程方法 | |
Pad | Pad | 焊垫 | |
PC Card | Type 2 PCMCIA memory card | PC Card | |
PCB | Printed circuit board | 印刷电路板 | |
PCBA | Printed circuit board asmbly | 印刷电路板装配 | |
PCE | Process Engineering | 工艺工程 | |
PTS | Performance to schedule | 计划完成状况 | |
PCN | Process Change Notification | 工程变更通知单 | |
PFMEA | Process FMEA | 制程失效模式与效应分析 | |
PI | Process Improvement | 制程改善 | |
PQC | Process Quality Control | 制程质量控制 | |
PV | Process Vacuum | 制程真空 | |
PC | Product Control Section | 生产管理部 | |
PE | Product Engineering Department | 产品工程部 | |
POH | Product on Hand | 預估在手量 | |
PP | Product Plan Section | 生產計劃課 | |
PDN | Product testing Deviation Notice | 产品测试异常通知單 | |
PD | Production Dept. | 生产部 | |
PPAP | Production Parts Approval Procedure | 生產件批准程序 | |
PDP | Production Planning Section | 生產專案計劃課 | |
PGM | Program | 程序 | |
PPS | Programmable Power Supply | 可编程电源供应 | |
PFW | Promotion From Within | 内部提升 | |
POD | Proof Of Delivery | 出货单 | |
POD | Package Outline Drawing | 封装外形图 | |
PO | Purcha Order | 采购单 | |
PR | Purcha Requisition | 请购单 | |
PR | Public Relationship | 公共关系 | |
PUR | Purchasing Section | 采购部 | |
Prober | Prober | 针测机 | |
Package | 封装类型 | ||
Plasma Cleanning | 等离子清洗 | ||
Physical Locations | 实际位置 | ||
Pick up tool | 吸嘴 | ||
Preheater | 预热 | ||
Protective Gloves | 保护手套 | ||
QFP | Quad Flat Pack | 四方形平面封裝 | |
QA | Quality Assurance Section | 质量保证 | |
QAD | ERP system ud at SanDisk | QAD | |
QAD | Quality Assurance Department | 质量保证部 | |
QCO | Qulity Change Order | 质量变更单 | |
QCP | Quality Control Plan | 质量管制计划 | |
QC | Quality Control Section | 质量管制 | |
QDN | Quality Deviation Notice | 品质异常通知单 | |
QFD | Quality Function Display | 質量功能展開 | |
QM | Quality Management Division | 品管处 | |
QMS | Quality Management System | 质量管理系統 | |
QS | Quality System Section | 质量系统部 | |
RC | 吹泡泡儿歌rated capacity | 定率产能 | |
RDN | Raw material Deviation Notice | 原材料异常通知單 | |
RMI | Raw Material Inventory | 原材料仓库 | |
RT | Receipt Traveler | 采购收货验收单 | |
REC | Record | 记录，记录器 | |
Rej | Reject | 不合格品， 剔出 | |
Relea | Relea | 允许，放行 | |
REL | Reliability | 可靠性 | |
Req. | Requisition | 用人需求 | |
R/T | Retest | 重测 | |
Rev. | Revision | 版本 | |
Rework | Rework | 返工 | |
RPN | Risk Priority Number | 風險領先指標 | |
RCCP | Rough Cut Capacity Planning | 粗略产能规划 | |
Run | Run | 生产 | |
R/C | Run Card | 流程卡 | |
RH | Relative Humidity | 相对湿度 | |
RHODES | Controller ud on CF, 3B and Flash Drives with NAND binary memory | RHODES | |
RHODES_1 | Same as Rhodes | RHODES_1 | |
RHODES_2 | Controller ud on CF, 3B and Flash Drives with NAND MLC memory | RHODES_2 | |
RMA | Returned material authorization | 退回物料认可 | |
RoHS | Substances | 有害物质的限制 | |
RS-MMC | Reduced size MMC. Designed for European cell phone market | RS-MMC | |
Re-flow | 回流焊 | ||
Resin Bleed | 注塑溢出 | ||
SAM | Scanning Acoustic Microscope | 超声波扫描显微镜 | |
SCC | Supply Chain Management | 供应链管理 | |
Scope | Microscope/Oscilloscope | 显微镜/示波器 | |
SD | Secure Digital card | SD | |
SDIL | SanDisk Israel | SDIL | |
SDKK | SanDisk Japan | SDKK | |
SDP3B | SanDisk type 2PCMCIA memory card. Sometimes referred to as 3B | SDP3B | |
SDSH | SanDisk Shanghai, China | SDSH | |
SD-SIP | Secure Digital card asmbled using an SIP module (not surface mount) | SD-SIP | |
SDTW | SanDisk Taichung,Taiwan | SDTW | |
SDUBGA | Stacked die ultra thin ball grid array (sharp package) | SDUBGA | |
SDUS | SanDisk USA | SDUS | |
SDXX | SanDisk Xixiang, Shenzhen, China | SDXX | |
Setup | Setup | 设置，装备 | |
SIP | System in package | 系统级封装 | |
SLC | Single level Cell | SLC | |
SMD | Surface Mount Device | 表面贴装器件 | |
SMMC | Stacked MMC (contains 2 memory devices) | SMMC | |
SMT | Surface mount technology (ud to asmble cards) | 表面贴装技术 | |
Socrates | Controller for memory stick, memory stick pro, and memory stick duo | Socrates | |
SOD | Substrate Outline Drawing | 基板外形图 | |
SPARTA | Bad generation of CF and 3B cards | SPARTA | |
SPIL | SPIL公司 | ||
SALES/CS | Sales / Customer Service Division | 销售/客服處 | |
SALES | Sales Department | 销售部 | |
Sample | Sample | 样品 | |
SEM | Scanning Electron Microscope | 电子扫描显微镜 | |
Scrap | Scrap | 报废 | |
Scratch | Scratch | 刮伤，刮痕 | |
Scribe L. | Scribe line | 切割道 | |
Sec. | Section | ||
Security | Security | 安全性 | |
SCU | Sen Control Unit | 感应控制单元 | |
Setup | Setup | 设置， 装备 | |
S/U | Site Unbalance | Site 不平衡 | |
Slot | Slot | 槽位 | |
SOJ | Small Outline J-lead Package | 小外型J接腳封裝 | |
SOP | Small Outline Package | 小外型封裝 | |
S/W | Software | 软件 | |
Sort | Sort | 测试，分类 | |
Sort Flow | Sort Flow | 测试流程 | |
SBC | Special Bin Account | 特殊bin计数 | |
SECR/N | Special Document & Engineering Change Request/Notice | 特殊文件及工程变更申请/通知 | |
SER | Special Engineer Report | 特殊工程变更 | |
SOR | Special Order Request | 特殊订单需求 | |
SPEC | Specification | 规范，说明书 | |
Spindle | Spindle | 转轴 | |
SOP | Standard Operation Procedure | 标准作业程序 | |
ST | Standard Time | 标准时间 | |
SPC | Statistical Process Control | 统计制程管制 | |
SIS | Strategic Information System | 策略信息系統 | |
Subcontractor | Subcontractor | 進貨廠商 | |
Summary | Summary | 总结 | |
Summary/report | Summary/report | 报表 | |
Supervisor | Supervisor | 主管 | |
SCM | Supply Chain Management | 供应链管理 | |
SOP | Support of Process | 支持過程 | |
Chipping | surface, bottom, side Chipping. | 碎裂 | |
SDRAM | Synchronous DRAM | SDRAM | |
SE | System Engineering | 系统工程 | |
Sagging wire | 金线下塌 | ||
Singulation | 切割成型 | ||
Stitch | 第二焊点 | ||
Stitch shape | 第二焊点形状 | ||
Strip | 条 | ||
Substrate | 基板 | ||
Transflash | Removable triflash product | Transflash | |
TST | Test Operation | 测试部 | |
TST | Thermal Shock Test | 液体冷热冲击测试 | |
Thermosonic wire bonder | 超声波焊线机 | ||
Transfer pressure | 注塑压力 | ||
TS | Technical Specification | 技术规范 | |
Temp | Temperature | 溫度 | |
TECR/N | Temporary Document & Engineering Change Request/Notice | 临时性文件及工程变更申請/通知 | |
TDTP | Test Data Transfer Program | 测试资料转换程序 | |
TD | Test Development Department | TD工程部 | |
TPU | Test Processor Unit | 测试過程單元 | |
Tester | Tester | 测试机 | |
TH | Tester Head Unit | 測試頭單元 | |
TOC | Theory of Constraints | 限制理論 | |
THK | Thickness | 厚度 | |
TQFP | Thin Quad Flat Pack | 薄型四方扁平封裝 | |
TSOP | Thin Small Outline Package | 薄型小尺寸封装 | |
TGU | Timing Generator Unit | 时钟发生器单元 | |
TPM | Total Production Management | 全面生产管理 | |
TQM | Total Quality Management | 全面质量管理 | |
TTV | Total Thickness Variation | 厚度总差异值 | |
TPS | Toyota Production System | 丰田生产方式 | |
Tray | Tray | 盘状IC存放容器 | |
Trial Run | Trial Run | 试产 | |
Tube | Tube | 存放IC的管条 | |
UPW | Ultra Pure Water | 超纯水 | |
UV | Ultraviolet | 紫外線 | |
UV-tape | 紫外线膜 | ||
UPS | Uninterrupted Power Supply | 不间断电源 | |
UPH | Unit Per Hour | 单位小时产出数 | |
Unloader | Unloader | 下料区/下板机 | |
UIF | Ur Interface Unit | 用户介面单元 | |
UMC | UMC公司 | ||
Unloader | Unloader | 下料机 | |
USB | Universal rial bus | USB | |
UTC | UTC公司 | ||
UTOP | Ultra-thin outline package | UTOP | |
UUT | Unit Under Test | 测试的样品 | |
UTIL | Utilization | 稼動率 | |
VI | Visual Inspection | 外观目检 | |
V/M | Visual Manual | 人工目检 | |
V-notch | V-notch | 8”V型缺口 | |
VCO | Vendor change order | 供应商更改单 | |
VIP | Vertically integrated partner (a CM that performs every manufacturing step) | VIP | |
VQFP | Very thin quad flat pack (controller package) | VQFP | |
VSOP | Very thin small outline package (thin TSOP) | VSOP | |
VIO | Voltage Input & Output Unit | 电压输入输出单元 | |
Wafer | Wafer | 晶圆,晶片 | |
Castte | wafer Castte, metal Castte | 晶圆盒， 材料箱 | |
WM | Wafer map | 晶圓測試圖 | |
WM | Wafer Mount | 贴片，贴片工艺 | |
W/S | Wafer Sort | 晶圆测试 | |
W/S | Workstation | 工作站 | |
WEEE | Waste electrical, electronic equipment | 废气电子设备 | |
WI | Work instrucion | 作业指导书 | |
WiFi | Same as WLAN (802.11b) | 无线互联网接入 | |
WLP | Wafer Level Package | 晶圆级封装 | |
WM | Wafer Mount | 贴膜 | |
WLAN | Wireless local area network standard (802.11b) | 无线局域网 | |
WM | Warehou Management Department | 倉庫管理部 | |
5W1H | When where who what why how | 5W1H | |
WIP | Work in process | 在线品 | |
W/S | Workstation | 工作站 | |
Warpage | 变形弯曲 | ||
Wafer mark | 水印 | ||
Wire crossing | 引线交叉 | ||
Wire damage | 金线受损 | ||
Wire sweeping | 引线弯曲 | ||
Wrist strap | 静电腕带 | ||
xD | xD Picturecard. Only ud on Olympus platforms | XD卡 | |
YOK | Yokkaichi,Japan.Toshiba wafer fab. | Yokkaichi公司 | |
Yield | Yield | 良品率 | |
Z | ZONE | 區 | |
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