FUNCTIONAL REQUIREMENTS
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1. FUNCTIONAL REQUIREMENTS
The history of electronic components is one of miniaturization and of increasing component-mounting densities. Active devices have evolved from vacuum tube through transistors to integrated circuits that contain peripheral circuitry as well. IC integration has advanced from LSI to VLSI, and continuing improvements in miconductor processing promi even greater advances in the future.
The packages that hou the ICs have also changed to accommodate developments in chip and mounting technology. Mitsubishi Electric now offers a complete line of standard packages that fulfill the vast majority of commercial application requirements, and custom-made packages to meet specialized needs.
IC packages generally have to provide the following performance features:
— Easier packaging
— Sufficient mechanical protection to protect IC chip from the environment of actual u道歉认错的话
— Heat generated in IC chip should be dissipated凤凰画法
— Package electrical characteristics should not affect device performance
In addition to such primary functions, recent evolution of the electronics industry has created important condary requirements that include:— More higher I/O pin counts
— Smaller and thinner package outlines
— A variety of packages for high density mounting
— Higher power dissipation and tighter dimensional tolerance for it
— Packages for automatic mounting
— Incread resistance to soldering temperatures
— Low internal stress and preventive measures to limit soft errors in nsitive devices
— Lower price.
2. IC PACKAGE CLASSIFICATION夸学生的评语
The following pages classify Mitsubishi Packages by the aling method and the mounting method. The conventions shown here are ud throughout this DATA BOOK, so we suggest you take the time to review them.
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PLASTIC PACKAGES
[Mounting Method]
No. of
pinout side
[Type]
[Outline]
Through-hole
mount
Surface mount
Single side
Dual sides
Dual sides
围棋的规则和玩法Quadruple sides
SIP
SDIP
DIP
(Dual Inline Package)SOP
(Small Outline Package)SSOP
枫桥夜泊古诗
(Shrink Small
Outline Package)TSOP
(Thin Small
Outline Package)SOJ
(Small Outline
J-leaded package)QFP
(Quad Flat Package)LQFP
(Low profile
Quad Flat Package)TQFP
QFJ
(Quad Flat
J-leaded package)
ZIP
HSIP
(SIP with Heatsink)[]
