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电路板(PCB)字汇整理
PCB字典
流程图PCB Mfg. FLOW CHART
UPDATED:1999,09,01
多层板内层流程
(INNER LAYER PRODUCT)
多次埋孔
Multiple Buried Via
JOHNNY HSU
顾客(CUSTOMER)
工程制前(FRONT-END DEP.)
裁板(LAMINATE SHEAR)
内层干膜(INNERLAYER IMAGE)
预叠板及叠板(LAY- UP )
通孔电镀(P . T . H .)
液态防焊(LIQUID S/M )
外观检查(VISUAL INSPECTION )
成型(FINAL SHAPING)
业务(SALES DEPARTMENT)
生产管理(P&M CONTROL)
蚀铜(I/L ETCHING)
钻孔(PTH DRILLING)
压合(LAMINATION)
外层干膜(OUTERLAYERIMAGE)
二次铜及锡铅电镀(PATTERN PLATING)
蚀铜(O/L ETCHING)
检查(INSPECTION )
喷锡(HOT AIR LEVELING)
电测(ELECTRICAL TEST)
出货前检查(O. Q. C. )
融资计划包装出货(PACKING&SHIPPING)
曝光(EXPOSURE)
压膜(LAMINATION)
前处理(PRELIMINARY TREATMENT )
显影(DEVELOPIG)
蚀铜(ETCHING)
去膜(STRIPPING)
黑化处理(BLACK OXIDE)
烘烤(BAKING)
预叠板及叠板(LAY- UP )
压合(LAMINATION)
后处理(POSTTREATMENT)
曝光(EXPOSURE)
压膜(LAMINATION)
二次铜电镀(PATTERNPLATING)
锡铅电镀(T/L PLATING)
去膜(STRIPPING)
蚀铜(ETCHING)
剥锡铅(T/L STRIPPING)
涂布印刷(S/M COATING)
预干燥(PRE-CURE)
曝光(EXPOSURE)
显影(DEVELOPING)
后烘烤(POST CURE)
MLB
全板电镀(PANEL PLATING)
铜面防氧化处理O.S.P (Entek Cu 106A)
外层制作
(OUTER-LAYER)
TENTING PROCESS
镀金手指(G/F PLATING)
镀化学镍金(E-less Ni/Au)
For O. S. P.
选择性镀镍镀金(SELECTIVE GOLD)
印文字(SCREEN LEGEND)
网版制作(STENCIL)怎么缓解尴尬
图面(DRAWING)
工作底片(WORKING A/W )
制作规范(RUN CARD)
程序带(PROGRAM )
钻孔, 成型机(D. N. C.)
底片(MASTER A/W)
磁盘, 磁带(DISK , M/T)
蓝图(DRAWING)
资料传送(MODEM , FTP)
A O I 检查(AOI INSPECTION )
除胶渣(DESMER)
通孔电镀(E-LESS CU)
DOUBLE SIDE
前处理(PRELIMINARY TREATMENT )
全面镀镍金(S/G PLATING)
雷射钻孔(LASER ABLATION)
Blinded Via
埋孔钻孔(I.V.H. DRILLING)
埋孔钻孔(I.V.H. DRILLING)
埋孔电镀(I.V.H. PLATING)
埋孔电镀(I.V.H. PLATING)糊涂蛋
埋孔(Buried via)
P1/136
* Process Module 说明:
A. 下料( Cut Lamination)
a-1 裁板( Sheets Cutting)
a-2 原物料发料(Panel)(Shear material to Size)
B. 钻孔(Drilling)
b-1 内钻(Inner Layer Drilling )
b-2 一次孔(Outer Layer Drilling )
b-3 二次孔(2nd Drilling)
b-4 雷射钻孔(Lar Drilling )(Lar Ablation )
b-5 盲(埋)孔钻孔(Blind & Buried Hole Drilling)
C. 干膜制程( Photo Process(D/F))
c-1 前处理(Pretreatment)
c-2 压膜(Dry Film Lamination)
c-3 曝光(Exposure)
c-4 显影(Developing)
c-5 蚀铜(Etching)
c-6 去膜(Stripping)
c-7 初检( Touch-up)
c-8 化学前处理,化学研磨( Chemical Milling )
c-9 选择性浸金压膜(Selective Gold Dry Film Lamination)
c-10 显影(Developing )
c-11 去膜(Stripping )
D. 压合Lamination
d-1 黑化(Black Oxide Treatment)
d-2 微蚀(Microetching)
Developing , Etching & Stripping ( DES )
d-3 铆钉组合(eyelet )
d-4 叠板(Lay up)
d-5 压合(Lamination)
d-6 后处理(Post Treatment)
d-7 黑氧化( Black Oxide Removal )
d-8 铣靶(spot face)
d-9 去溢胶(resin flush removal)
E. 减铜(Copper Reduction)
e-1 薄化铜(Copper Reduction)
F. 电镀(Horizontal Electrolytic Plating)
f-1 水平电镀(Horizontal Electro-Plating) (Panel Plating)
f-2 锡铅电镀( Tin-Lead Plating ) (Pattern Plating)
f-3 低于1 mil ( Less than 1 mil Thickness )
f-4 高于1 mil ( More than 1 mil Thickness)
f-5 砂带研磨(Belt Sanding)
f-6 剥锡铅( Tin-Lead Stripping)
f-7 微切片( Microction)
G. 塞孔(Plug Hole)
g-1 印刷( Ink Print )
g-2 预烤(Precure)
g-3 表面刷磨(Scrub)
g-4 后烘烤(Postcure)
H. 防焊(绿漆): (Solder Mask)
h-1 C面印刷(Printing Top Side)
h-2 S面印刷(Printing Bottom Side)
h-3 静电喷涂(Spray Coating)
h-4 前处理(Pretreatment)
h-5 预烤(Precure)
h-6 曝光(Exposure)
h-7 显影(Develop)
h-8 后烘烤(Postcure)
h-9 UV烘烤(UV Cure)
h-10 文字印刷( Printing of Legend )
h-11 喷砂( Pumice)(Wet Blasting)
h-12 印可剥离防焊(Peelable Solder Mask)
I . 镀金Gold plating
i-1 金手指镀镍金( Gold Finger )
i-2 电镀软金(Soft Ni/Au Plating)
i-3 浸镍金( Immersion Ni/Au) (Electroless Ni/Au)
J. 喷锡(Hot Air Solder Leveling)
j-1 水平喷锡(Horizontal Hot Air Solder Leveling)
j-2 垂直喷锡( Vertical Hot Air Solder Leveling)
j-3 超级焊锡(Super Solder )
j-4. 印焊锡突点(Solder Bump)
K. 成型(Profile)(Form)
西游记梗概500字
k-1 捞型(N/C Routing ) (Milling)
23456789k-2 模具冲(Punch)
k-3 板面清洗烘烤(Cleaning & Backing)
k-4 V型槽( V-Cut)(V-Scoring)
k-5 金手指斜边( Beveling of G/F)
L. 短断路测试(Electrical Testing) (Continuity & Insulation Testing)
l-1 AOI 光学检查( AOI Inspection)
l-2 VRS 目检(Verified & Repaired)
l-3 泛用型治具测试(Universal Tester)
l-4 专用治具测试(Dedicated Tester)
l-5 飞针测试(Flying Probe)
M. 终检( Final Visual Inspection)
m-1 压板翘( Warpage Remove)
m-2 X-OUT 印刷(X-Out Marking)
m-3 包装及出货(Packing & shipping)
m-4 目检( Visual Inspection)
m-5 清洗及烘烤( Final Clean & Baking)
m-6 护铜剂(ENTEK Cu-106A)(OSP)
m-7 离子残余量测试(Ionic Contamination Test )(Cleanliness Test)空调前十名
m-8 冷热冲击试验(Thermal cycling Testing)
江夏别宋之悌m-9 焊锡性试验( Solderability Testing )
N. 雷射钻孔(Lar Ablation)
N-1 雷射钻Tooling孔(Lar ablation Tooling Hole)
N-2 雷射曝光对位孔(Lar Ablation Registration Hole)
