专利名称：ALUMINUM-ZINC METALLIZATION 发明人：COLEMAN; MICHAEL G.
申请号：US35818073
江南水乡壁纸申请日：19730507
公开号：US3863334A
公开日：
19750204
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摘要：There is disclod an aluminum-zinc alloy ohmic contact for miconductor materials and methods for providing the ohmic contacts. This aluminum-zinc alloy contact has special application in P-type III-V compound miconductor materials, and particular advantage in lightly doped P-type III-V compound miconductors, to decrea the contact resistance, increa uniformity of the contact, improve wire bonding ea and quality, decrea electromigration, and decrea the substrate temperature for contact formation. In addition this alunimum-zinc alloy provides that formation of brittle gold-aluminum intermetallic compounds on the surface of the contact is retarded or eliminated when gold wire is ud for wire bonding. The aluminum-zinc contact is also ud to advantage on elemental miconductor materials and with II-VI compound miconductor materials for the purpo of decreasing electromigration. Most importantly, in the P-type III-V compound miconductors, a contact made from the aluminum-zinc alloy lf-dopes the region directly under the contact, forming a highly doped region below the contact. The highly doped region is formed by zinc atoms from the alloy. Formation of the highly doped region in this manner is thus accomplished without the necessity of parate dopings and/or photolithographic steps.
申请人：MOTOROLA, INC.
美术学科>退社申请书
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