专利名称：SEMICONDUCTOR DEVICE AND
MANUFACTURING METHOD THEREOF
发明人：Hironori KAWAMINAMI随缘乐助
写秋景的作文申请号：US15927115
我很好英文申请日：20180321
公开号：US20180294215A1
公开日：关于假期的作文
20181011
专利内容由知识产权出版社提供
专利附图：
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摘要：A miconductor device includes: a first miconductor chip that includes
through electrodes; a cond miconductor chip; and an interpor that has a recesd portion formed in a front surface thereof and includes a first wiring provided under a那一刻我长大了作文500字
兔和鼠bottom surface of the recesd portion, in which the first miconductor chip is fitted in the recesd portion with a chip top surface thereof flipped down to be electrically connected to the first wiring, the cond miconductor chip is connected on the front surface, of the interpor, around the recesd portion, and at the same time, is stacked on the first miconductor chip in a manner to partially overlap the first miconductor chip, and is electrically connected to the first miconductor chip via the through electrodes.
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申请人：FUJITSU LIMITED
地址：Kawasaki-shi JP
国籍：JP
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