专利名称：WAFER PARTICLE REMOVAL
发明人：Jiann Lih Wu,He Hui Peng,Jeng-Jyi
Hwang,Chi-Ming Yang面积计算器
申请号：US14059713
申请日：20131022
队伍建设
灯具排行公开号：US20150107619A1
公开日：八月十六
20150423
专利内容由知识产权出版社提供
专利附图：
摘要：Among other things, one or more techniques or systems for particle removal from a miconductor wafer are provided. Particles, contaminating a miconductor wafer, have the potential to cau defects, such as scratches into a surface of the
miconductor wafer during chemical mechanical polishing or defocusing during a subquent lithography stage, for the miconductor wafer. Accordingly, a mechanic particle cleaner component, such as at least one of a sliver brush roller, a pencil brush, a tape polish, a sonic jet, or a liquid spray component, is configured to apply a mechanical force to an edge region of the miconductor wafer to detach particles. A chemical particle cleaner component is configured to apply a chemical force to the edge region to detach particles. In this way, particles are removed from the miconductor wafer before or after chemical mechanical polishing.
硬盘对拷申请人：Taiwan Semiconductor Manufacturing Company Limited
反游猫鱼
地址：Hsin-Chu TW
国籍：TW
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