专利名称：Method of test probe alignment control
发明人：Jui-Long Chen,Chien-Chih Liao,Chin-Hsiang
Lin,Hui-yun Chao,Jong-I Mou,Tng Chin
Lo,Ta-Yung Lee
仰组词
申请号：US14659268
申请日：20150316
倒装句文言文公开号：US10161965B2
公开日：小米fastboot
20181225
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风行软件专利附图：
扁鳕鱼摘要：A system and method for aligning a probe, such as a wafer-level test probe,with wafer contacts is disclod. An exemplary method includes receiving a wafer
containing a plurality of alignment contacts and a probe card containing a plurality of probe points at a wafer test system. A historical offt correction is received. Bad on the historical offt correct, an orientation value for the probe card relative to the wafer is determined. The probe card is aligned to the wafer using the orientation value in an attempt to bring a first probe point into contact with a first alignment contact. The connectivity of the first probe point and the first alignment contact is evaluated. An electrical test of the wafer is performed utilizing the aligned probe card, and the historical offt correction is updated bad on the orientation value.
申请人：Taiwan Semiconductor Manufacturing Company, Ltd.
地址：Hsin-Chu TW
国籍：TW
代理机构：Haynes and Boone, LLP
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