专利名称：Plasma chamber wafer clamping ring with erosion resistive tips
兰亭序歌词
发明人：Ray C. Lee,Mu-Tsun Ting,Jen-Hui Hsiao,Troy Chen
申请号：US09/183014
申请日：19981030
书法行书
描写竹子的词语公开号：US06166898A
公开日：
驴肉饺子馅怎么调20001226
冷漠英文>电信网络诈骗
专利内容由知识产权出版社提供
摘要：A plasma erosion resistive clamping ring is provided for clamping a wafer in a plasma treatment chamber. The plasma erosion resistive clamping ring compris a ring and one or more tips cured to, and mutually spaced apart about, a circumference of the ring. Each of the tips projects away from the ring, in a radial direction, towards an interior of the ring. Each tip has plural side surfaces that taper to, and meet, a single, continuous surface of rotation. The surface of rotation is located in the interior of the ring at a location of the tip which is radially most distant from the ring. The meeting of the tapered sides at the single continuous surface of rotation has a cross-ction, taken in a plane of the ring, as follows. The cross-ction compris first and cond line gments, on lines that interct at an acute angle, and an arc of a convex ellip, that begins at an end of the first line gment most distant from the ring, and ends at an end of the cond line gment most distant from the ring.
申请人：PROMOS TECHNOLOGIES, INC.,MOSEL VITELIC, INC.,SLEMENS AG
女生打网球的好处代理机构：Proskaur Ro LLP
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