专利名称：High resolution patterning on solid
substrates
发明人：Schnur, Joel M.,Schoen, Paul E.,Peckerar, Martin,Calvert, Jeffrey M.,Georger, Jacque
沙漠旅行H., Jr.,Marrian, Christie R.K.滴字组词
申请号：EP91105301.5
申请日：19910404
开学报到公开号：EP0506993A1
公开日：
王梓盈19921007
种类物专利内容由知识产权出版社提供
摘要：A process for producing metal plated paths on a solid substrate of the kind which has polar functional groups at its surface, utilizing a lf-asmbling film that is chemically adsorbed on the substrate's surface. The solid substrate may, for example, be an insulator of the kind ud for substrates in printed circuitry or may, as another example, be a miconductor of the kind ud in miconductor microcircuitry. The chemical reactivity in regions of the ultra-thin film is altered to produce a desired pattern in the film. A catalytic precursor which adheres only to tho regions of the film having enough reactivity to bind the catalyst is applied to the film's surface. The catalyst coated structure is then immerd in an electroless plating bath where metal plates onto the regions activated by the catalyst.
申请人：GEO-CENTERS, INC.
神话故事大禹治水地址：7 Wells Avenue Newton Centre, Massachutts 02159 US
国籍：US
代理机构：Bunke, Holger, Dr.rer.nat. Dipl.-Chem.更多信息请下载全文后查看英语日记50字
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