专利名称：VOID REDUCTION IN SOLDER JOINTS USING
射手和巨蟹OFF-EUTECTIC SOLDER鼻子出血是什么原因引起的
发明人：Kabir J. MIRPURI
申请号：US16079054
申请日：20160322
公开号：US20190067176A1
公开日：
代码走查20190228
专利内容由知识产权出版社提供
实用文体专利附图：
摘要：Embodiments herein may relate to an apparatus with a package that includes a first substrate soldered to a cond substrate via solder comprising an off-eutectic solder material. The off-eutectic solder material may form a joint between the first
解救的意思substrate and the cond substrate. The off-eutectic solder material may be any suitable material that melts over a range of temperatures, which may provide a relatively slow collap of the off-eutectic solder material during a melting process. The relatively slow collap may provide a sufficient amount of time for gas to escape prior to collap, and thus, the joint between the first substrate and the cond substrate may have less voids compared to joints formed using eutectic solder materials. Other embodiments may be described and/or claimed.
申请人：Intel Corporation
养阴清肺汤
地址：Santa Clara CA US
国籍：US关于石榴的资料
春节为什么挂灯笼更多信息请下载全文后查看
