Smt属于转换英语
THT(Through Hole Technology):通孔安装技术
SMT(Surface Mounted Technology):表面安装技术
PTH (Pin Through the Hole):通孔安装
THT (Through Hole Component) :通孔插装元件
SMB (Surface Mount Printed Circuit Board):表面安装PCB板
SMC (Surface Mount Component):表面安装元件
SMD (Surface Mount Device):表面安装器件
SMA (Surface Mount Asmbly):表面安装组件
Component:元件
Device:器件
Asmbly:组件
CTE(coefficient of thermal expansion):热膨胀系数
In-circuit test:在线测试
Lead configuration:引脚外形
Placement equipment:贴装设备
Reflow soldering:回流焊接
Repair:修理
Rework:返工丰都
Solderability:可焊性
Soldermask:阻焊
Yield:产出率
Packaging density:装配密度
Chip:片状元件
melf:圆柱形元件
PCB(Printed circuit board):印刷电路板
DIP:双列直插
SIP:单列直插
SOT(Small Outline Transistor):小外形晶体管
SOIC(Small outline IC):小外形集成电路,
SOP(Small outline Package):小外型封装
PLCC(Plastic Leaded Chip Carrier):塑型有引脚芯片载体
LCCC(Leadless Ceramic Chip Carrier):无引脚陶瓷芯片载体
QFP(Quad Flat Package):多引脚方形扁平封装
BGA( Ball grid array)球栅列阵
CSP(Chip Scale Package):芯片规模的封装
Bare Chip:裸芯片
Accuracy:精度
ATE(Automated test equipment):自动测试设备
AOI(Automatic optical inspection):自动光学检查
Blind via:盲孔海底两万里好词好句摘抄>甘肃平凉崆峒山
Buried via:埋孔
through via:通孔
Bridge:锡桥
Circuit tester:电路测试机
白衣女门把手CTE(Coefficient of the thermal expansion):温度膨胀系数
Cold solder joint:冷焊锡点
Component density:元件密度
Copper foil:铜箔
Copper mirror test:铜镜测试
Cure:烘焙固化
Cycle rate:循环速率
Defect:缺陷
Desoldering:卸焊
Downtime:停机时间
FPT(Fine-pitch technology):密脚距技术魔术技法
Flip chip:倒装芯片
FCT(Functional test):功能测试
Golden boy:金样
ICT(In-circuit test):在线测试
JIT(Just-in-time):刚好准时
Lead configuration:引脚外形
Packaging density:装配密度
Pick-and-place:拾取-贴装设备
Placement equipment:贴装设备成都周边好玩的地方
长子猪头肉Reflow soldering:回流焊接
Repair:修理
Rework:返工
Defect SoldeR少锡
Schematic:原理图
Solder bump:焊锡球
Solderability:可焊性
Soldermask:阻焊
Tape-and-reel:带和盘
Tombstoning:元件立起
Ultra-fine-pitch:超密脚距
Yield:产出率
solder mask:阻焊漆
silk screen:丝印面
via:导孔
Copper Clad Laminates:覆铜箔层压板
past mask:焊膏膜(漏板)
solder mask:焊接掩摸(阻焊膜)
Solding Pasts:焊锡膏
Stencils:模板、漏板、钢板
Bridging:搭锡
Cursting:发生皮层
Excessive Paste:膏量太多
Insufficient Paste:膏量不足
Poor Tack Retention:粘着力不足
Slumping:坍塌
Smearing:模糊
Dpm(defects per million):百万缺陷率
Flexibility:柔性
Modularity:模块化
Component Pick-Up:元件拾取
Component Check:元件检查
Component Transport:元件传送
Placement Procedure:元件放置
Chamber System:炉膛系统
Blowholes:吹孔
Voids:空洞
Movement:移位
Misalignment:偏斜
Dewetting:缩锡
Dull Joint:焊点灰暗
Non-Dewetting:不沾锡
Accuracy:精度
Additive Process:加成工艺
Adhesion:附着力
Aerosol:气溶剂
Angle of attack:迎角
Anisotropic adhesive:各异向性胶
Annular ring:环状圈
Application specific integrated circuit :ASIC特殊应用集成电路
Array:列阵
Artwork:布线图
Automated test equipment:ATE自动测试设备
Bond lift-off:焊接升离
Bonding agent:粘合剂
CAD/CAM system:计算机辅助设计与制造系统
Capillary action:毛细管作用
Chip on board :COB板面芯片
Circuit tester:电路测试机
Cladding:覆盖层
Cold cleaning:冷清洗
Cold solder joint:冷焊锡点
Conductive epoxy:导电性环氧树脂
Conductive ink:导电墨水
Conformal coating:共形涂层
Copper foil:铜箔
Copper mirror test:铜镜测试
Cure:烘焙固化
nought materiel 无料
Cycle rate:循环速率
Data recorder:数据记录器
Defect:缺陷
Delamination:分层
Desoldering:卸焊
Dewetting:去湿
DFM:为制造着想的设计
万有引力之虹
Dispersant:分散剂
Documentation:文件编制
Downtime:停机时间
Durometer:硬度计
Environmental test:环境测试
Eutectic solders:共晶焊锡
Fiducial:基准点
Fillet:焊角
Fine-pitch technology :FPT密脚距技术