专利名称：Trace design for bump-on-trace (BOT)
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葆的拼音繁衍什么意思发明人：Yen-Liang Lin,Chen-Shien Chen,Tin-Hao Kuo
成都市动物园申请号：US15456134
申请日：20170310
中国节假日公开号：US10269759B2
公开日：
当归羊肉
20190423
专利内容由知识产权出版社提供
专利附图：
摘要：A bump-on-trace (BOT) interconnection in a package and methods of making the BOT interconnection are provided. An embodiment BOT interconnection compris a landing trace including a distal end, a conductive pillar extending at least to the distal end
of the landing trace; and a solder feature electrically coupling the landing trace and the conductive pillar. In an embodiment, the conductive pillar overhangs the end surface of the landing trace. In another embodiment, the landing trace includes one or more recess for trapping the solder feature after reflow. Therefore, a wetting area available to the solder feature is incread while permitting the bump pitch of the package to remain small.
申请人：Taiwan Semiconductor Manufacturing Company, Ltd.
地道酬善地址：Hsinchu TW应聘求职
国籍：TW
代理机构：Slater Matsil, LLP
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