項次No.
圖例
Figure
不良現象
Reason Code
不良現象描述
Reason Code Description
1短路
Short
在無任何偏移的狀況下，零件腳(端電極)間產生焊錫橋接之情形
Solder bridge between pins or electrodes without any shift.
2
腳高翹
PIN Bent
非短路
(NOT short)
零件腳變形，導致短路
Solder bridge caud by pin bent.
3
腳高翹
PIN Bent
非空焊
(NOT open)
零件腳變形，導致空焊
Open caud by pin bent.
4偏移
Shift
安邦定国
長方體狀零件橫向超出pad之偏移量大於零件寬度之半(即X>1/2W)
The lateral shift of cuboid components is more than 1/2 body width over the pad.(i.e. X>1/2W)
圓筒狀零件橫向超出pad之偏移量大於零件寬度之半(即X>1/3W)
The lateral shift of cylindrical components is more than 1/3 body width over the pad.(i.e. X>1/3W)
5
偏移
Shift
零件腳橫向超出pad之偏移量大於零件腳寬度之半(即X>1/2W)
The lateral shift of the pin is more than 1/2 pin width over the pad.(i.e. X>1/2W)
零件腳外緣與PAD外緣距離小於5mil(即S<5mil)
w
x s
x x
w
項次No.
圖例
Figure
不良現象
Reason Code
不良現象描述
Reason Code Description
6
偏移
Shift
非短路
(NOT short)
置件偏移(零件腳超出PAD)，造成零件腳間短路
Solder bridge caud by shift over the pad.
7
偏移植物的图片
Shift
非短路
(NOT short)
置件偏移(端電極超出PAD)，造成零件端電極間短路
Solder bridge caud by electrodes shift over the pad.
8
多件
Excess
零件未置於pad上方
Components is not mounted on the pad.
9
缺件
挥洒汗水
Missing
該置件的位置上沒有零件，且焊點表面平滑
The surface of the solder point is rounded without the desired component on it.
10破件、撞件
Broken话术聊天
該置件的位置上沒有零件，且焊點表面尖銳粗糙，有斷裂痕跡
The surface of the solder point is rough or sharp-cut without disired component on it.
項次No.
圖例
Figure
不良現象
Reason Code
不良現象描述
Reason Code Description关于春联的故事
11破件、撞件
Broken
零件表面有破損痕跡
The body of the component is damaged.
12破件、撞件
Broken
零件外形非六面長方體
The body of the component is not cuboid.
13
側翻
Side Up
零件兩端電極雖已形成焊點，但零件側面翻轉約90度
The component is side-up with both electrodes touch the pad.
14
立碑
Tombstone
零件一側端電極與pad形成焊點，而一端未與pad接觸並拉起
Lifting of one electrode and the other electrode of the component is fixed to the pad.
15
翻面
Rever
在同一片PC板上，多於2顆CHIP類電阻零件文字面上下翻轉(若僅1顆或僅2顆翻面為允收)
The marking side of chip resister is upside down with more than 2 rever components in one PCB.
(If only one or two chips rever, it is accept)
項次No.
圖例
Figure
三百字作文经费申请请示范文
不良現象
Reason Code
不良現象描述
Reason Code Description
16助焊劑殘留
Flux Residue
迴焊爐滴下的flux污染PC板，造成PC板髒污外觀不良
The flux dropped from the reflow contaminate the PCB.
17
極反
Polarity
Wrong
零件上所標示的極性與PC板文字面、Golden Sample或目檢罩板上之極性標示不符
The direction of polarity mark is different from the mark in PCB, Golden Sample or visual stencil.
18
錫球
Solder Ball
錫球的直徑大於8mil
The diameter of the solder ball is bigger than 8 mil.
19BGA偏移
BGA shift
非短路
(NOT short)
BGA最外緣底材，超出PC板上白框線
Solder bridge caud by the BGA substrate over the white line.
20空焊 Open 除錫裂冷焊、腳高翹、錫不足、立碑、PCB Line Open以外原因造成之零件未與solder形成焊點。Open besides solder crack, cold solder, pin bent, poor solder, tombstoning and PCB line open.
項次No.
圖例
Figure
不良現象
Reason Code
不良現象描述
Reason Code Description
21BGA空焊
BGA Open
BGA本體不超出白框的情形下，ICT 測出BGA open或目檢可辨識焊點分離。
BGA open tested by ICT and the its body didn't over the white square.
22
錫裂
Solder Crack
零件與PCB間的solder破裂分離，且分離處表面粗糙。慈鲷鱼
The solder crack beneath the component and PCB and the crack surface is rough.
23
冷焊
Cold Solder
焊點表面不平滑(顆粒狀)且無光澤，錫未熔。
The solder didn't ramp up to the component. The surface of the solder is rough and the part of the solder paste didn't
melt.
24
錫不足
Poor Solder
PCB PAD上無錫或錫爬升高度未達workmanship規定高度。
There is no solder on the PCB pad and the solder ramp up height didn't conform to the WOKMANSHIP.
25
錫過多
Excess
Solder
Solder將件腳或端電極完全包覆, 無法清楚辨識其輪廓。
The lead or electrode is coverd by the solder and difficult to determine its shape. INTEL
BGA
