专利名称：CHIP TRAY
发明人：IWASHIMIZU TADASHI 申请号：JP5040585春节手抄报花边
申请日：19850315
公开号：JPS61210654A
食不言寝不语的意思>葵花籽是果实吗公开日：
我是钢铁侠英文
19860918生活就是舞台
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二十万行长诗
摘要：PURPOSE:To obtain more excellent conductivity without adver effect on contained chips, by applying a thin metal film such as aluminum on a chip tray. CONSTITUTION:Chips such as miconductor and bubble memories are contained in recess parts 2 in a chip tray 1 and nt to each process. The ba material of the chip tray 1 compris a rsin material such as alkylbenzenesulfonate like the conventional tray. A metal such as Al or Sn is applied on the chip plate 1 by evaporation or plating. When a thin metal film is applied on the chip plate 1 in this way, the conductivity of the surface of the chip tray 1 is improved, and charging can be prevented approximately perfectly. Effefts of contamination of the contained chips due to added materials can be also prevented. Commercially available products can be ud for the matrix. Large merits such as low costs and good availability are provided.
申请人：HITACHI LTD
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