HT1621/HT1621G
RAM Mapping 32´4LCD Controller for I/O MCU
PATENTED
PAT No.:TW 099352
Selection Table
Rev.3.001April 29,2011
Features
形容雪景的优美句子
·Operating voltage:2.4V~5.2V ·Built-in 256kHz RC oscillator
清蒸鲤鱼的做法
·External 32.768kHz crystal or 256kHz frequency
source input弊是什么意思
·Selection of 1/2or 1/3bias,and lection of 1/2or
1/3or 1/4duty LCD applications
·Internal time ba frequency sources
·Two lectable buzzer frequencies (2kHz/4kHz)·Power down command reduces power consumption ·Built-in time ba generator and WDT ·Time ba or WDT overflow output ·8kinds of time ba/WDT clock sources
·32´4LCD driver
·Built-in 32´4bit display RAM ·3-wire rial interface
·Internal LCD driving frequency source ·Software configuration feature如何进行市场调研
·Data mode and command mode instructions ·R/W address auto increment ·Three data accessing modes
·VLCD pin for adjusting LCD operating voltage ·HT1621:44-pin QFP/LQFP package
HT1621B:48-pin SSOP/LQFP packages HT1621G:Gold bumped chip
General Description
The HT1621is a 128pattern (32´4),memory mapping,and multi-function LCD driver.The S/W configuration feature of the HT1621makes it suitable for multiple LCD applications including LCD modules and display sub-
systems.Only three or four lines are required for the in-terface between the host controller and the HT1621.The HT1621contains a power down command to re-duce power consumption.
Block Diagram
Note:CS:Chip lection
BZ,Tone outputs
WR,RD,DATA:Serial interface
COM0~COM3,SEG0~SEG31:LCD outputs
IRQ:Time ba or WDT overflow output
Pin Assignment
Rev.3.002April29,2011
Pad Assignment
Chip size:82´83(mil)2离婚合同
Bump height:18m m±3m m
楚些Min.Bump spacing:23.02m m
时光飞逝的诗句Bump size:76´76m m2
*The IC substrate should be connected to VDD in the PCB layout artwork.
Rev.3.003April29,2011
郑州植物园Pad Coordinates Unit:m m
Pad Description
Rev.3.004April29,2011
Absolute Maximum Ratings
V SS-0.3V to V SS+5.5V -50o C to125o C .V SS-0.3V to V DD+0.3V -40o C to85o C
Note:The are stress ratings only.Stress exceeding the range specified under²Absolute Maximum Ratings²may cau substantial damage to the device.Functional operation of this device at other conditions beyond tho listed in the specification is not implied and prolonged exposure to extreme conditions may affect device reliability. D.C.Characteristics Ta=25°C
Rev.3.005April29,2011
