TOSHIBA Photo IC Silicon Epitaxial Planar
TPS851
Mobile Phones, PHS Notebook PCs, PDAs
Video cameras, Digital Still Cameras
Other Equipment Requiring Luminosity Adjustment
The TPS851 is an ultra-compact surface-mount photo-IC for
illuminance nsors which incorporates a photodiode and current amp circuit in a single chip.
The nsitivity is superior to that of a phototransistor, and exhibits little variation.
小暖男的意思
It has spectral nsitivity clor to luminous efficiency and excellent output linearity.
With its ultra-compact surface-mount package, this photo-IC can be ud as the power-saving control for domestic appliances or for
表达能力差
backlighting for displays in cellular phones, this device enables low power consumption to be achieved.
· Ultra-compact and light surface-mount package suitable for lead-free
soldering and reflow soldering: 2.0 × 2.1 × 0.7 mm · Excellent output linearity of illuminance
· Little fluctuation in light current and high level of nsitivity : I L = 37 µA to 74 µA @E V = 100 lx using fluorescent light : Light current variation width: ×1.67
(when light current classification is specified.)
: Little temperature fluctuation
· Built-in luminous-efficiency correction function, reduced nsitivity variations due to various light sources : I L (using incandescent light)/I L (using fluorescent light) = 1.2 (typ.)
· Low supply voltage, making device suitable for battery-powered equipment: V CC = 2.7 V to 5.5 V
Maximum Ratings (Ta = 25°C)
Characteristics Symbol Rating
Unit
Supply voltage V CC -0.5 to 7
V
Output voltage V OUT
<=V CC V
红砖大学
Light current
I L 5 mA Permissible power dissipation P 35 mW Operating temperature range T opr -30 to 85 °C Storage temperature range T stg
-40 to 100
°C Soldering temperature range
(Note 1)
T sol 260
°C
Note 1: The reflow time and the recommended temperature profile are shown in the ction entitled Handling
Precautions.
JEDEC ― JEITA ― TOSHIBA
―
Weight: 0.0054 g (typ.)
Recommended Operating Conditions
Characteristics Symbol Min Typ.
Max
Unit
Supply voltage
V CC 2.2 ¾ 5.5 V
Electrical and Optical Characteristics (Ta = 25°C)
Note 2: CIE standard A light source is ud (color temperature = 2856K, approximated incandescence light). Note 3: Fluorescence light is ud as light source. However, white LED is substituted in a mass-production process.
I L classification I L (3) ® A: 37 m A to 62 m A, B: 44 m A to 74 m A Note 4: Light current measurement circuit
Note 5: Ri time/fall time time measurement method
OUT OUT I F
GND
Package Dimensions
Weight: 0.0054 g (typ.)
Block Diagram
1. V CC
5. OUT 2. GND 3. NC Current amp
4. NC
: Light-receiving area Size of light-receiving area: (□0.35 mm)
Unit: mm
Tolerance: ±( ): Reference Pin connection 1. V 2. GND 3. NC 4. NC 5. OUT
Center of nsitive area
Handling Precautions
At power-on in darkness, the internal circuit takes about 100 m s to stabilize. During this period the output signal is unstable and may change. Plea take this into account.
Moisture-Proof Packing
(1) To avoid moisture absorption by the resin, the product is packed in an aluminum envelope with silica gel.
(2)
Since the optical characteristics of the device can be affected during soldering by vaporization
resulting from prior absorption of moisture and they should therefore be stored under the following conditions:
Temperature: 5°C to 30°C, Relative humidity: 60% (max), Time: 168 h (max)
(3)
Baking is required if the devices have been store unopened for more than six months or if the aluminum envelope has been opened for more than 168 h.
The devices are packed on tapes; hence, plea avoid baking at high temperature. Recommended baking conditions: 60°C for 12 h or longer
Mounting Precautions
太斯米(1) Do not apply stress to the resin at high temperature.
(2) The resin part is easily scratched, so avoid friction with hard materials.
(3)
When installing the asmbly board in equipment, ensure that this product does not come into contact with other components.
断案如神Mounting Methods
(1) Reflow soldering
· Package surface temperature: 260°C (max)
· Plea perform reflow soldering using the following reference temperature profile.
Perform reflow soldering no more than twice.
· Plea perform the first reflow soldering within 168 h after opening the package with reference to
the above temperature profile. · Second reflow soldering
In ca of cond reflow soldering, it should be performed within 168 h after first reflow under the above conditions.
Storage conditions before cond reflow soldering: 30°C, 60% RH or lower · Do not perform flow soldering.水果冰
· Make any necessary soldering correction manually.
宽窄巷子美食(do not do this more than once for any given pin.) Temperature: no more than 350°C (25 W for soldering iron)
Time: within 5 s
Time (s) ®
T e m p e r a t u r e (°C ) ®
(2) Recommended soldering pattern
(3) Cleaning conditions
When cleaning is required after soldering
Chemicals: AK225 alcohol
Temperature and time: 50°C ´ 30 s or 30°C ´ 3 mins Ultrasonic cleaning: 300 W or less
Packing Specification
(1) Packing quantity
Reel (minimum packing quantity)
3,000 devices Carton
5 reels (15,000 devices)生活无忧
(2) Packing format
An aluminum envelope containing silica gel and reels is deaerated and aled.
Pack shock-absorbent materials around the aluminum envelopes in the cartons to cushion them.
· Carton specification
Carton dimensions (W) 81 mm ´ (L) 280 mm ´ (H) 280 mm
0.4
Unit: mm
