SAMPLE POLISHING METHOD AND SAMPLE POLISHING DEVIC

更新时间:2023-06-27 12:52:07 阅读: 评论:0

专利名称:SAMPLE POLISHING METHOD AND SAMPLE
蹦组词被坚执锐POLISHING DEVICE欺凌近义词
发明人:WATABE KYOJI,渡部 橋司,HORII KENICHI,堀井
謙一
申请号:JP特願平11-155736
申请日:19990602
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公开号:JP特開2000-343406(P2000-343406A)A
公开日:
20001212
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专利附图:
长大之后>一样高的英文摘要:PROBLEM TO BE SOLVED: To shorten dressing time when exchanging polishing pads and to stabilize ordinary dressing done for a polishing pad during u to restore a
polishing rate. SOLUTION: As a dressing head dressing by pressing a dress face of a polishing pad 3 against a surface of the polishing pad 3 fixed on a polishing surface plate 2, a first dressing head 51 having a relatively fine dress face and suppressing a dressing amount and a cond dressing head 52 having a relatively coar dress face and increasing a dressing amount are provided. They are ud independently in accordance with a condition of the polishing pad 3 to be polished or are ud by combining them appropriately.
申请人:SUMITOMO METAL IND LTD,住友金属工業株式会社
地址:大阪府大阪市中央区北浜4丁目5番33号
国籍:JP
代理人:河野 登夫
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