WORK INSTRUCTION
作 业 指 导 书
DOC. No. / 文件编号: FMPEI-364 | REV./ 版本号: 06 | PRODUCT/ 产品: All |
TITLE / 标题: Moisture Sensitive Devices Control Instruction 温湿敏元件的控制 指引 | PAGE/页数 1 OF 16 |
REVISION HISTORY / 版本记录 |
REVISION 版本 | CHANGE DESCRIPTION 修改内容 | ISSUER 发布者 | 刘光霞RELEASE DATE 发行日期 |
01 02 03 04 05 06 | ---Combine FAPEI-079/合并FAPEI-079 Add item 6.9 and 6.10 and delete MSDs List F1.01 Add item 6.8.2 Update to FMPEI-364-F3.02 Add content in item 6.0 “ MSD control diagram”/增加第6.0项MSD控制表 Update 6.2.4& 6.2.6 更新6.2.4&6.2.6 | Teresa Zhai Teresa Zhai Teresa Zhai Teresa Zhai Brave Xian Teresa Zhai | 09/01/08 09/12/08 10/11/08 02/26/09 09/04/09 10/12/09 |
REMARK 备注 Hardcopy to MBU and Store | | APPROVAL | |
| DEPARTMENT | | NAME | | TITLE | |
| 部门 | | 名字 | | 职位 | |
| Computing PE | | Brave Xian | | Engineer | |
励志解释 | | | | 配电自动化 | | |
| | | | | | |
| | | | | | | | | | | | |
DMP-001-F2 .01
1.0 Purpo / 目的
信念的诗句Provide a handling and baking procedure for Moisture Sensitive Devices.
提供正确的湿敏元件处理及烘烤程序.
2.0 Scope/范围
This procedure is only applied to Flex-computing PCBA all products.
此程序适用于伟创力计算机产品业务所有项目.
FAPEI-079 is not applied to Flex-computing PCBA.
FAPEI-079不适用于Flex-computing PCBA
3.0 Define(定义)
3.1 MSDs Moisture Sensitive Devices / 防潮包裝元件
3.2 MBBs Moisture Barrier Bags / 防潮袋
3.3 HIC Humidity Indicator Card, A card on which a moisture nsitive
chemical is printed such that it will change color from blue to pink when the indicated relative humidity is exceeded.
湿度指示卡:表面涂有湿度敏感化学原料,当湿度超过一定范围时卡会由蓝色变为粉红.
3.4 Desiccant An absorbent material ud to maintain a low relative humidity in moisture barrier bags for dry packing moisture nsitive devices.
干燥剂 用于维持防潮包装里的相对低的湿度
3.5 Shelf Life The time that a dry-packed moisture-nsitive device may be stored in an unopened
moisture barrier bag (MBB) such that the required interior bag ambient humidity is maintained.
保存限期 指防潮包装元件在防潮袋中（开封前）的保存时间.
3.6 Floor Life The allowable time period, after removal from a moisture barrier bag and before the solder reflow process, for moisture nsitive device to be expod to a factory ambient not exceeding 30oC and 70% RH.
使用有效期 : 是指在不超过30oC和70%RH的环境条件下,防潮包装在开封后和过回流前的可允许暴露
4.0 REFERENCE（参考文件）
IPC/JEDEC J-STD-033B- Handling, Packing, Shipping and U of Moisture/Reflow Sensitive Surface
IPC-SM-786A --- Procedure For Characterizing and Handling of Moisture/Reflow Sensitive Ics.
IPC/JEDEC J-STD-022D --- Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Device
FAP-010 --- Internal BOM Generation Procedure
5.0 Responsibility / 责任
5.1 MBU / 生产部
5.1.1 Operators must clearly know the MSDs list for each model. 爬上屋顶
操作人员必须清楚知道各个产品的防潮元件清单
5.1.2 Operators must properly handle the MSD package.
操作人员必须正确处理防潮包装元件
5.1.3 Mark the record accordingly. / 作相应的记录
5.1.4 Monitor the storage and baking condition of the MSDs
监控防潮元件的存储和烘的情况
5.1.5 Monitor the using status of the MSDs
监控防潮元件的使用情况.
人工河
5.1.6 Inform PE relative staffs to handle the special ca.
若有特发事件请及时通知PE相关的人员
5.2 PE / 制造工程部
5.2.1 Provide MSDs list for each model. / 提供各个产品的防潮元件清单
5.2.2 Determine the MSDs storage and baking condition ba on component supplier’s guidelines (including component specification and anti-moisture label)
根据元件供应商的指引(包括元件说明和防潮标签)决定防潮元件的存储和烘烤的条件
5.2.3 Issue WI for the special MSDs / 为特殊的防潮包装元件编写WI
6.0 PROCEDURE（程序）
基本操作流程监控如下: Flowchart as below to reflow.
参考以下表格里的要求火神轰炸机, 对湿敏元件进行监控操作.
以下为详细的规范要求:
6.1 Dry packed SMD packages should be inspected for a bag al date located on the caution or barcode label.
干燥包装的防潮元件标签或条形码检查.
6.1.1 If there is no expiry date but with aling date, the valid shelf life is 12 months at temperature <40℃ and < 90% RH after the aling date
如果没有保存期而只有封装日期, 则在封装日期后, 防潮包装元件能在<40℃和<90%RH的条件内保存12个月6.1.2 If the incoming packing has been cracked, the component must be baked before production.
如果温湿敏感元件的來料包装破裂,必须经过烘烤才可以使用.
母畜调教6.2 Inspection and Tracking after open the packing
打开包装后的检查及追踪
6.2.1 A moisture-nsitive device to be expod to a factory ambient should not exceed 30°C and 70% RH after removal from moisture barrier bag and before the solder reflow process, Or el, it should be baked in oven before next round u.
