AMD Athlon™ 64 and AMD Opteron™ Processors Thermal Design Guide
Publication # 26633 Rev: 3.03
Issue Date: September 2003
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26633 Rev. 3.03 September 2003 AMD Athlon™ 64 and AMD Opteron™ Processors Thermal
Design Guide
lol进游戏黑屏Contents
Revision History (9)
Chapter 1Introduction (11)
1.1 Summary of Requirements (11)
Chapter 2AMD Athlon™ 64 and AMD Opteron™ Processors Thermal
Requirements (13)
2.1 AMD
Athlon™ 64, AMD Athlon 64 FX, and AMD Opteron™ Processor
Specifications (13)
Description (14)
2.2 Socket
2.3 Motherboard Component Height Restrictions (16)
2.4 Thermal Solution Design Requirements (18)
2.5 Sample Heatsinks and Attachment Methods (19)
2.5.1 Thermal Reference Design Solution 1 (19)
让我永远爱你2.5.2 Thermal Reference Design Solution 2 (22)
2.6 Thermal Solution Design Considerations (25)
2.6.1 Backplate Asmbly (25)
2.6.2 Spring Clip (25)
2.6.3 Retention Frame (26)
2.6.4 Heatsink (26)
2.6.5 Fans (30)
2.6.6 Thermal Interface Material (33)
2.6.7 EMC Shield (33)
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Chapter 3Conclusion (35)
A Appendix (37)
Instrumentation (37)
A.1 Thermocouple
A.1.1 Ca Thermocouple Attachment (37)
A.1.2 Heatsink Thermocouple Attachment (40)
A.1.3 Ambient Thermocouple Attachment (40)
A.2 Procedure for Clip Load Testing (41)
A.2.1 Equipment (41)
Contents 3
26633 Rev. 3.03 September 2003
AMD Athlon™ 64 and AMD Opteron™ Processors
Thermal Design Guide
A.2.2 Procedure (45)
A.3 Motherboard Component Keep-Out Areas and Height Restriction Drawings (47)
A.4 Thermal Reference Design Solution Component Drawings (68)
明生活4 Contents
26633 Rev. 3.03 September 2003 AMD Athlon™ 64 and AMD Opteron™ Processors Thermal
Design Guide
List of Figures
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Figure 1. 754-pin µPGA Socket Ud for the AMD Athlon™ 64 Processor (14)
Figure 2. 940 pin µPGA Socket Ud for the AMD Opteron™ Processor (15)
Figure 3. Motherboard Component Height Restrictions for the AMD Athlon 64 Processor Thermal Solution (16)
Figure 4. Motherboard Component Height Restrictions for the AMD Opteron Processor Thermal Solution (17)
Figure 5. AMD Athlon 64 and AMD Opteron Processors Thermal Reference Design Solution 1 (20)
Figure 6. Thermal Reference Design Solution 1 Components Asmbled for Shipment (21)
Figure 7. View of an Installed Heatsink Utilizing the Thermal Reference Design Solution 1 (21)
Figure 8. Exploded View of the Components Utilized in the AMD Athlon 64 and
AMD Opteron Processors Thermal Reference Design Solution 2 (23)
Figure 9. Thermal Reference Design Solution 2 Components Configured for Shipment (24)
Figure 10. View of a Heatsink Installation Utilizing the Thermal Reference Design
Solution 2 (24)
Figure 11. Example of a Low-Cost Heatsink Using Aluminum Extrusion Technology (27)
Figure 12. High Performance Heatsink with Copper Slug Embedded in the Ba (28)
Figure 13. Required Exhaust Airflow Direction for Motherboard Voltage Regulator Cooling (29)
Figure 14. Typical Temperature-Fan Speed Relation for Speed-Controlled Fan (31)
Figure 15. Acoustic Noi from Sample Thermal Solutions with a 70x15 mm Fan (32)
Figure 16. Diagonals Marked on Processor to Locate Center (37)
Figure 17. Thermocouple Taped to Processor Lid (38)
Figure 18. Thermocouple Attached to Processor with Strain Relief on Package and PCB (39)
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Figure 19. Heatsink with Thermocouple Relief Groove Machined into Ba (39)
Figure 20. Heatsink Thermocouple Relief Groove and Measurement Hole (40)
广州莲花山Figure 21. An Entran ELW-D1 Load Cell (41)
Figure 22. Load Cell Inrted into the Load Cell Fixture (42)
Figure 23. Drawing of Load Cell Fixture for the Entran ELW-D1 Load Cell (43)
Figure 24. Test Board with a Load Cell Fixture Installed in the Socket 754 (45)
Figure 25. Heatsink Installation over the Load Cell Fixture (46)
List of Figures 5
